Lidar chip packaging structure and packaging method

A chip packaging structure, laser radar technology, applied in the direction of semiconductor/solid-state device components, instruments, semiconductor devices, etc., can solve the problem of difficult integration, improve integration, save components and structures, and achieve high packaging integration. Effect

Active Publication Date: 2022-07-12
NAT CENT FOR ADVANCED PACKAGING CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a laser radar chip packaging structure and packaging method to solve the problem that the existing laser radar chip packaging is not easy to integrate

Method used

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  • Lidar chip packaging structure and packaging method
  • Lidar chip packaging structure and packaging method
  • Lidar chip packaging structure and packaging method

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Embodiment Construction

[0046] The packaging structure and packaging method of the laser radar chip proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become apparent from the following description and claims. It should be noted that, the accompanying drawings are all in a very simplified form and in inaccurate scales, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present invention.

[0047] Furthermore, unless stated otherwise, features in different embodiments of the invention may be combined with each other. For example, a certain feature in the second embodiment can be used to replace the corresponding or functionally identical or similar feature in the first embodiment, and the resulting embodiment also falls within the scope of disclosure or description of the present application.

[0048] ...

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Abstract

The present invention provides a lidar chip packaging structure and packaging method, including: an optical chip, which is arranged in a first package, and the first package has a lens shape; an electrical chip, which is arranged in the second package, The second package body has a first electrical interconnection structure, and the first electrical interconnection structure leads out the electrical properties of the electrical chip; the first package body and the second package body are arranged by stacking.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a packaging structure and a packaging method for a laser radar chip. Background technique [0002] Lidar is a key component in applications such as autonomous driving and autonomous robotics. With the popularization of lidar equipment, lidar chip packaging is also developing towards miniaturization. [0003] In the prior art, a ceramic metal package is usually used, and the optical and electrical chips are packaged separately. The optical chip is encapsulated in a ceramic package with a light window, and the lens group and the emitting mirror realize the emission and reception of light in a specific direction, and the corresponding control electric chip and optical chip are packaged in two packages respectively. In this way, the packaging cost is high, the volume is large, and it is not easy to integrate. SUMMARY OF THE INVENTION [0004] The purpose of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/16H01L23/31H01L21/50H01L21/56G01S7/481
CPCH01L25/167H01L23/3114H01L21/50H01L21/56G01S7/481
Inventor 孙瑜曹立强刘丰满
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD
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