Semiconductor chip and manufacturing method thereof

Abstract

The invention discloses a semiconductor chip and a manufacturing method thereof. The manufacturing method of the semiconductor chip comprises the following steps: providing a substrate, wherein a plurality of semiconductor chip areas and cutting channel areas between adjacent semiconductor chip areas are defined in the substrate; forming a sealing ring surrounding the semiconductor chip region and located between the scribe line region and the semiconductor chip region; forming a protection groove in the boundary position, close to the sealing ring, of the semiconductor chip cutting channel area; and cutting the substrate in the scribe line region to divide the plurality of semiconductor chips into individual semiconductor chips. According to the semiconductor chip manufacturing method, the difficulty of a scribing process can be reduced, and the yield of chips can be improved.

Description

Technical field[0001]The present invention relates to the field of semiconductor devices, and in particular, to a semiconductor chip and a method of fabricating thereof.Background technique[0002]In the existing new 3D NAND product architecture, the storage unit area (Cell) and the peripheral (CMOS) are fabricated on different wafers, and the circuit is connected together by three-dimensional special processes, from the back cover Cell, the wafer, The circuit is then protected by a passivation film and a polyimide layer (PASSIVATION FILM) and a polyimide layer according to the package requirements.[0003]Before the use of the electronic product, the die (DIE) needs to be separated (drawn), and due to the passivation layer extremely easy to fall off, even damaged the duck, it is extremely high requirements for the drawing process. In an existing diaphragm method, the effective window of the process is small, the process is difficult, and the speed of moving the scribe cutting knife and...

AI Technical Summary

Problems solved by technology

In the existing scribing method, the effective window of the process is small and the process is difficult. The speed of the moving scribing knife and the rotational speed of the scribing knife must be strictly controlled to reduce chipping on the chip during scribing.

In addition, the minimum cutting width of a general dicing blade is about 40 μm, and the width of the scribe lane is 75 μm. During cutting, the passivation layer and polyimide layer will be squeezed to both sides, and even the chip will be damaged, resulting in a loss of yield.

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