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A thermally conductive resin composition and preparation method thereof

A heat-conducting resin and composition technology, applied in the field of potting glue, can solve the problems of thermal conductivity, insulation, manufacturability and practical balance, and achieve the effect of increasing the content of heat-conducting fillers

Active Publication Date: 2022-07-26
ZHEJIANG RONGTAI TECH ENTERPRISE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that it is difficult to achieve a balance between thermal conductivity, insulation, manufacturability and practicability in the prior art, a thermal conductive resin composition and a preparation method thereof are provided

Method used

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  • A thermally conductive resin composition and preparation method thereof
  • A thermally conductive resin composition and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043]A thermally conductive resin composition is prepared from the following raw materials: 11 grams of component A, 100 grams of component B and an appropriate amount of component C.

[0044] The preparation of component A is: after mixing 99.5 grams of PM200 and 0.5 grams of BYK-066N, vacuum defoaming at 60°C for 30 minutes, and then lowering to 25°C to prepare.

[0045] The preparation of component B is as follows: 29 grams of castor oil, 0.3 grams of BYK-066N, 0.2 grams of BYK-9076, 0.5 grams of fumed silica, and 70 grams of M50D alumina are dispersed at high speed for 20 minutes, dehydrated in a vacuum at 120 ° C for 2 hours, and reduced prepared at room temperature.

[0046] The preparation of component C is prepared by drying spherical alumina with a diameter of 3.0 mm at 110° C. for 5 hours, and then reducing the nitrogen protection to room temperature.

[0047] A preparation method of a thermally conductive resin composition is as follows: manually stirring 11 grams...

Embodiment 2

[0049] The thermal resin composition is prepared from the following raw materials: 7.5 grams of component A, 100 grams of component B and 150 grams of component C.

[0050] The preparation of component A is: after mixing 99.5 grams of PM200 and 0.5 grams of BYK-066N, vacuum defoaming at 60°C for 30 minutes, and then lowering to 25°C to prepare.

[0051] The preparation of component B is: 19 grams of castor oil, 0.3 grams of BYK-066N, 0.2 grams of KH-560 (γ-(2,3-glycidoxy)propyltrimethoxysilane), 0.5 grams of gas-phase dioxide Silicon and 80 grams of M50D alumina were dispersed at high speed for 20 minutes, dehydrated in vacuum at 120°C for 2 hours, and cooled to room temperature to prepare component B.

[0052] The preparation of the C component is as follows: drying spherical alumina with a diameter of 1.5 mm at 110° C. for 5 hours, and nitrogen protection is lowered to room temperature to become the C component.

[0053] A preparation method of a thermally conductive resin ...

Embodiment 3

[0055] A thermally conductive resin composition is prepared from the following raw materials: 6 grams of component A, 100 grams of component B and 100 grams of component C.

[0056] The preparation of component A is: after mixing 99.5 grams of PM200 and 0.5 grams of BYK-066N, vacuum defoaming at 60°C for 30 minutes, and then lowering to 25°C to prepare.

[0057] The preparation of component B is as follows: 14 grams of castor oil, 0.3 grams of BYK-066N, 0.2 grams of KH-560, 0.5 grams of fumed silica, and 85 grams of M50D alumina are dispersed at high speed for 20 minutes, dehydrated in vacuum at 120 ° C for 2 hours, and then reduced to room temperature to prepare component B.

[0058] The preparation of the C component is as follows: drying spherical alumina with a diameter of 0.8 mm at 110° C. for 5 hours, and nitrogen protection is lowered to room temperature to become the C component.

[0059] A preparation method of a thermally conductive resin composition is as follows: ...

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Abstract

The present application relates to the technical field of potting glue, in particular to a thermally conductive resin composition and a preparation method thereof. A thermally conductive resin composition is prepared from the following raw materials: a component, a component B and a component C; the molar amount of the isocyanate group contained in the A component and the mole of the hydroxyl group contained in the B component The amount ratio is (1.0-0.9): (1.0-0.9); the weight of the C component is 50% to 300% of the weight of the B component. The present application has both thermal conductivity, insulation, manufacturability and practicality. The preparation method is as follows: preparation of component A, preparation of component B and preparation of component C, stirring and mixing component A and component B, then fully mixing component C with the mixture of A and B, and injecting after vacuum defoaming. The finished product is obtained by curing and forming in the mold. The preparation method adopts a three-component composition and a secondary mixing process, which effectively increases the content of thermally conductive fillers without using solvents, and also solves the problem that the viscosity is too high and cannot be operated due to high filler content. Contradictory to obtain high thermal conductivity materials.

Description

technical field [0001] The present application relates to the technical field of potting glue, and in particular, to a thermally conductive resin composition and a preparation method thereof. Background technique [0002] With the development of the electronic information industry, the application of electronic products is becoming more and more extensive, and the problem of heat generation during the use of electronic products is becoming more and more serious. Due to the low thermal conductivity of air, it is only about 0.02W / mk. In order to solve the problem of heat dissipation, at present, the usual method is to fill the substitute air with materials with good thermal conductivity, so that the heat generated during the working of electronic products can be dissipated smoothly. [0003] Polymer resin has good fluidity, can be cured, and is easy to use. It has been widely used in various electronic products. However, although the thermal conductivity of the polymer mater...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G18/06
CPCC09J175/14C09J11/04C08K2003/2227C08K2201/003C08K3/36C08K3/22C08K7/18
Inventor 郑敏敏王宝湖沈彬马苗葛凡
Owner ZHEJIANG RONGTAI TECH ENTERPRISE
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