Processing method of PI reinforcement, manufacturing method of flexible circuit board with PI reinforcement and flexible circuit board

Abstract

The invention discloses a processing method of PI reinforcement, a manufacturing method of a flexible circuit board with PI reinforcement and the flexible circuit board. According to the invention, a cover film with an effect required by a flexible circuit board product is adopted to replace printing ink in an original PI reinforcement area, characters on the PI reinforcement and the flexible circuit board are processed separately, cover films and pure glue are respectively attached to the top surface and the bottom surface of the PI reinforcement, then the PI reinforcement is divided into small rolls or die-cut into single PCS according to requirements of corresponding processing equipment, and then subsequent processing is carried out. According to the manufacturing method of the flexible circuit board, the characters are subjected to silk-screen printing on the substrate which is not pasted with the PI reinforcement, the surface of the substrate is flat, silk-screen printing is easy, and the silk-screen printing precision of the characters can be improved; and the cover film is attached to the PI reinforcement for replacement, the cover film has high stamping resistance and liquid medicine resistance, layering and falling off are avoided in the punching process and the follow-up process, poor falling off of original printing ink can be eradicated, and the product quality and yield are improved.

Description

technical field [0001] The invention relates to the technical field of making flexible circuit boards, in particular to a PI-reinforced processing method, a method for manufacturing a PI-reinforced flexible circuit board, and a flexible circuit board. Background technique [0002] The flexible circuit boards used in some electronic products need to be pasted with PI reinforcement, and silk screen printing ink on the PI reinforcement. For example, in the field of backlight electronic products, it is necessary to screen print white ink on the PI reinforcement surface of the flexible circuit board to improve product performance; existing Fabrication method of flexible circuit board with PI reinforcement, such as figure 1 As shown, PI reinforcement material preparation → PI reinforcement bottom surface glue preparation → PI reinforcement slitting, and then use the edge punching and bonding automatic reinforcement machine to attach to the substrate, press and bake on the substrat...

AI Technical Summary

Problems solved by technology

[0002] The flexible circuit boards used in some electronic products need to be pasted with PI reinforcement, and silk screen printing ink on the PI reinforcement. For example, in the field of backlight electronic products, it is necessary to screen print white ink on the PI reinforcement surface of the flexible circuit board to improve product performance; existing Fabrication method of flexible circuit board with PI reinforcement, such as figure 1 As shown, PI reinforcement material preparation → PI reinforcement bottom surface glue preparation → PI reinforcement slitting, and then use the edge punching and bonding automatic reinforcement machine to attach to the substrate, press and bake on the substrate, in the silk screen printing process In the process, the characters and the ink in the PI reinforcement area are screen-printed on the substrate 100 together. Because the substrate is bonded with PI reinforcement, the heights of different areas on the substrate are different. During silk screen printing, the screen printing accuracy of the characters and the PI reinforcement area is poor. Neither meet product requirements

In addition, due to the relatively smooth surface of the PI reinforcement and the characteristics of the ink, the ink on the PI reinforcement is easy to fall off during the subsequent processing, especially when the product shape is punched and shaped, such as figure 2 and image 3 As shown, after the ink in the PI reinforcement area is punched, the ink in the PI reinforcement edge area corresponding to the product shape is brittle and falls off due to the impact force, and in the subsequent processing, it is vulnerable to the attack of the liquid medicine and aggravates the ink drop-off. The existing production method, product quality is poor, defect rate is high

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