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Wafer adjusting device and method and wafer conveying system

A technology of adjustment device and adjustment method, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., can solve problems such as wafer yield decline, and achieve the effect of shortening the time-consuming adjustment

Pending Publication Date: 2021-06-04
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manual adjustment needs to open the airtight door of the wafer transfer area. Once the airtight door is opened, the wafer will be exposed to the air, which will lead to a decrease in wafer yield.

Method used

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  • Wafer adjusting device and method and wafer conveying system
  • Wafer adjusting device and method and wafer conveying system
  • Wafer adjusting device and method and wafer conveying system

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Embodiment Construction

[0024] An embodiment of the present invention provides a wafer adjustment device, which can detect the deviation of the deviation of the wafer, and perform corresponding position adjustment according to the deviation.

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art can understand that in each embodiment of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical solutions claimed in this application can also be realized.

[0026] figure 1 It is a schematic structural diagram of a wafer adjustment device provided by an embodiment of the present invention.

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Abstract

The embodiment of the invention relates to a wafer adjusting device and method and a wafer conveying system. The wafer adjusting device comprises a bearing part and a detection device, wherein the detection device is used for detecting a wafer to obtain detection information; an adjusting device which is connected with the first bearing assembly and the second bearing assembly in the bearing component, drives the first bearing assembly to move relative to the second bearing assembly and drives the second bearing assembly to move relative to the first bearing assembly; and an analysis controller which is connected with the detection device and the adjusting device, receives the detection information of the detection device, analyzes and processes the detection information, and sends a processing signal to the adjusting device according to a processing result, and the adjusting device drives the first bearing assembly to move relative to the second bearing assembly and drives the second bearing assembly to move relative to the first bearing assembly according to the processing signal. According to the invention, the deviation condition of the deviated wafer can be detected, and corresponding position adjustment can be carried out according to the deviation condition.

Description

technical field [0001] The invention relates to the field of wafer manufacturing, in particular to a wafer adjustment device and method, and a wafer transfer system. Background technique [0002] Since the manufacturing of wafers includes multiple specific processes, and the manufacturing locations of different processes are different, it is usually necessary to transfer wafers between processes through a transfer table. Due to the requirements of the wafer process and the wafer yield rate, the wafer transfer area is filled with nitrogen gas, so as to avoid the reaction between oxygen and the material of the wafer. [0003] Currently, manual adjustments are required when wafers are shifted during transfer. However, manual adjustment needs to open the airtight door of the wafer transfer area. Once the airtight door is opened, the wafer will be exposed to the air, which will lead to a decrease in wafer yield. Contents of the invention [0004] Embodiments of the present in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/68H01L21/677
CPCH01L21/67253H01L21/67259H01L21/67742H01L21/681
Inventor 高鹏飞
Owner CHANGXIN MEMORY TECH INC
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