Electroplating device for core body of single-core connector

Abstract

The invention discloses an electroplating device for the core body of a single-core connector. The electroplating device is characterized in that single-core connectors are uniformly arranged on a positioning plate, a conductive plate is arranged at the upper end of the positioning plate, conductive probe springs connected with the upper ends of the connector cores are uniformly arranged at the upper end of the conductive plate, and the lower end of the positioning plate is connected with an isolating plate through an insulating plate; and the connector core body sequentially passes through the insulating plate and the isolating plate from top to bottom. The electroplating device is horizontally placed in an electroplating bath, the plating metal in the electroplating bath serves as an anode, the core serves as a cathode, optimal current distribution is guaranteed, positive ions of the plating metal are reduced on the surface of the core body to form a plating layer, a traditional wire binding and core plating process is changed, the electroplating labor cost is greatly reduced, the dependence on skilled employees is reduced, and the enterprise risk is reduced; and the electroplating appearance quality is improved, the core body plating leakage quality problem caused by poor contact between the wire mark and the binding wire is solved, and the electroplating qualification rate is increased.

Description

technical field [0001] The invention belongs to the technical field of electroplating, and in particular relates to an electroplating device for a core body of a single-core connector. Background technique [0002] Glass sintered single-core connectors have the advantages of simple structure, excellent sealing and mechanical properties, high pressure resistance, corrosion resistance, and strong radiation resistance. In recent years, they have been widely used in complex and harsh environments such as aviation, aerospace, and oceans. In order to ensure the above performance, it is necessary to electroplate the lead or core body and shell of the single-core connector during production. Since the core and shell of the connector are separated by sintered glass, the two are not conductive. During the electroplating process, the core conducts poorly. After gold plating, the film thickness of the core is much lower than that of the shell, and the gold plating of the core The thick...

AI Technical Summary

Problems solved by technology

There are currently two general solutions in the electroplating industry: one is to electroplate the entire connector to the thickness of the gold layer required for the core body. The biggest disadvantage of this process is that the thickness of the gold layer on the shell will be much greater than the required film thickness, and the gold consumption The waste is large and the production cost is high; another method is to first implement electroplating on the entire connector to make the shell reach the required gold-plated film thickness, and then bind the core body, that is, use thin copper wire as the core power supply wire, manually Wrap around the single pin or core of each connector, and then individually plate the core to the required thickness of gold layer through a special jig

There are three disadvantages in this wire binding process: it is difficult to bind wires, due to the small size of the connector, the general size is only about 1 square centimeter or less, the unilateral gap of the core is only about 1 mm or less, and manual binding is difficult , so this process has always had the problems of large manual workload and low production efficiency; due to the missing plating caused by the binding line printing and the loose contact of the binding copper wire, the yield rate is low; the binding copper wire consumes a lot of gold and is uneconomical

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