Semiconductor packaging equipment and packaging method

Abstract

The invention relates to semiconductor packaging equipment and a packaging method. The equipment comprises an L-shaped table, a cutting mechanism, a taking mechanism and a surface mounting mechanism; the L-shaped table is installed on the existing working ground, the cutting mechanism is arranged at the upper end of the left end of the L-shaped table, the taking mechanism is installed at the upper end of the right end of the L-shaped table, and the surface mounting mechanism is arranged on the right side of the taking mechanism, and is installed on the upper end face of the right end of the L-shaped table; the taking mechanism and the mounting mechanism are perpendicular to the cutting mechanism. According to the semiconductor packaging equipment and the packaging method provided by the invention, semiconductor packaging is carried out by adopting a design concept of a linkage structure; the rapid semi-automatic conversion cooperation among the cutting mechanism, the taking mechanism and the mounting mechanism can greatly improve the semiconductor packaging efficiency and reduce the probability of manual errors, and a structure with the effect of absorbing and removing impurities generated by cutting is arranged to improve the cleaning degree of the surface of a wafer; therefore, the subsequent forming quality of the semiconductor can be improved.

Description

technical field [0001] The invention relates to the field of semiconductor processing, in particular to a semiconductor packaging device and a packaging method. Background technique [0002] Semiconductor refers to materials whose electrical conductivity is between conductors and insulators at room temperature. Semiconductor packaging refers to the process of processing wafers that have passed the test to obtain independent chips according to the product model and functional requirements. Testing, chip packaging and post-package testing, after the wafer is plasticized, a series of operations are also performed, such as post-curing, rib cutting and molding, electroplating, and printing processes. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting. , high-power power conversion and other fields have applications, such as diodes are devices made of semiconductors, but the following problems will o...

AI Technical Summary

Problems solved by technology

[0003] (1) The conversion between the various processes of semiconductor packaging is mostly carried out manually, and the manual conversion takes a long time, and errors are prone to occur during the conversion process. The degree of clamping is easy to be in a low state;

[0004] (2) The size of the wafer formed by wafer cutting is relatively fixed, so that the overall utilization rate of the cutting structure is low, and the degree of sufficient cutting of the wafer is low, and the impurities generated during the wafer cutting process cannot be removed in time

Images