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Power semiconductor module cooling device and power semiconductor module

A technology of power semiconductors and cooling devices, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of reduced production efficiency, many failure points, and reduced cooling effect, so as to improve assembly efficiency and assembly The effect of simple process and reduced failure points

Pending Publication Date: 2021-06-11
中创杜菲(北京)汽车科技有限公司
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  • Description
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AI Technical Summary

Problems solved by technology

[0003] The structure of the power semiconductor module cooling device in the prior art is relatively complicated, and many spare parts are required, which not only causes tediousness in the assembly process, thereby reducing production efficiency, but also due to errors or assembly reasons in the interrelated process of various parts Will create more failure points, resulting in reduced cooling effect

Method used

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  • Power semiconductor module cooling device and power semiconductor module
  • Power semiconductor module cooling device and power semiconductor module
  • Power semiconductor module cooling device and power semiconductor module

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Embodiment Construction

[0026] The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0027] Embodiments of the present invention: as Figure 1-4 As shown, a power semiconductor module cooling device is disclosed, including: a cooling housing 1 having a heat exchange cavity 10 and side walls arranged on the front and rear sides of the cooling housing 1 and forming the heat exchange cavity 10 The front cooling plate 2 and the rear cooling plate 3. The cooling shell 1 also has a water inlet channel 11 and a water outlet channel 12 communicating with the cooling cavity 10; the front side heat sink 2 is tightly connected with the cooling shell 1 through integral welding, and the rear The side radiator plate 3 is tightly connected to the cooling shell 1 through integral welding.

[0028] In this embodiment, the water inlet channel 11, the heat exchange chamber 10 and the water ou...

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Abstract

The invention discloses a power semiconductor module cooling device and a power semiconductor module. The power semiconductor module cooling device comprises a cooling shell with a heat exchange cavity, a front side heat dissipation plate and a rear side heat dissipation plate, wherein the front side heat dissipation plate and the rear side heat dissipation plate are arranged on the front side and the rear side of the cooling shell and form the side walls of the heat exchange cavity, the cooling shell is further provided with a water inlet channel and a water outlet channel which are communicated with the cooling cavity, the front side heat dissipation plate and the cooling shell are integrally welded, and the rear side heat dissipation plate and the cooling shell are integrally welded. According to the invention, auxiliary accessories are reduced, the assembly process is simplified, failure points are reduced, and heat dissipation can be carried out on the semiconductor power assembly more stably.

Description

technical field [0001] The invention relates to the technical field of new energy vehicles, in particular to a power semiconductor module cooling device and a power semiconductor module. Background technique [0002] With the continuous improvement of people's awareness of environmental protection, energy saving and emission reduction, new energy vehicles have become a hot spot that major car companies and related institutions in the world are vying to develop. As one of the key components of new energy vehicles, the power semiconductor module in the electric vehicle controller will generate a lot of heat during its operation. Therefore, how to effectively dissipate heat from the power semiconductor module affects the operating performance of the power semiconductor module. [0003] The structure of the power semiconductor module cooling device in the prior art is relatively complicated, and many spare parts are required, which not only causes tediousness in the assembly pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/367
CPCH01L23/473H01L23/367
Inventor 黄斌斌
Owner 中创杜菲(北京)汽车科技有限公司
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