High-bandwidth ultrasonic transducer and preparation method thereof
An ultrasonic transducer, high-bandwidth technology, applied in the direction of the fluid using vibration, can solve the problems of narrow frequency range and limited application, and achieve the effect of widening the bandwidth, improving the imaging quality, and improving the detection accuracy
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Embodiment 1
[0037] Such as figure 1 Shown is an embodiment of the high-bandwidth ultrasonic transducer of the present invention, including a matching layer 1, a backing layer 2, a plurality of piezoelectric array elements 3 arranged in an array, and an acoustic lens 4 for focusing ultrasonic beams , the piezoelectric array element 3 is provided with a first electrode surface 31 and a second electrode surface 32 arranged in a plane, the second electrode surface 32 is an emitting surface and is perpendicular to the polarization direction, and the first electrode surface 31 The spacing between the second electrode surface 32 and the second electrode surface 32 changes regularly, the backing layer 2, the piezoelectric array element 3, the matching layer 1, and the acoustic lens 4 are arranged in sequence, and the first electrode surface 31 is attached to the backing layer 2 and arranged , the second electrode surface 32 is attached to the matching layer 1 . In this embodiment, each piezoelec...
Embodiment 2
[0050] Such as Figure 7 Shown is the embodiment of the preparation method of the ultrasonic transducer of high bandwidth, comprises the following steps:
[0051] S10. bonding multiple piezoelectric block arrays to the matching layer 1, the matching layer 1 is a flexible and bendable structure;
[0052] S20. After step S10, polish the side of the piezoelectric block away from the matching layer 1, and reattach electrodes;
[0053] S30. After step S20, cut along the thickness change direction of the piezoelectric block to obtain the piezoelectric array element 3, the polished surface of the piezoelectric block is the first electrode surface 31, and the bonding surface of the piezoelectric block and the matching layer 1 is second electrode face 32;
[0054] S40. After step S30, lead out the signal line and the ground wire of the piezoelectric array element 3, and bend the matching layer 1 and the piezoelectric array element 3 to form a ring structure;
[0055] S50. After step...
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