High-efficiency packaging equipment and packaging method for large-scale integrated circuit chips
A large-scale integrated circuit and packaging equipment technology, which is applied in packaging, transportation packaging, transportation and packaging, etc., can solve the problems of slow packaging speed, easy damage to the surface skin of fingers, and easy wear and tear of fingerprints on the surface of the thumb, so as to improve the accuracy of delivery , improve delivery efficiency, and avoid the effect of over-catch
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[0050] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific drawings. It should be noted that, in the case of no conflict, the embodiments and Features in the embodiments can be combined with each other.
[0051] see Figure 1-9 It is a schematic diagram of the overall structure of a large-scale integrated circuit chip high-efficiency packaging equipment and packaging method;
[0052] A large-scale integrated circuit chip high-efficiency packaging equipment, including a workbench 1, which is placed horizontally, the bottom end of the workbench 1 is fixed with a support leg 2 standing on the ground, and the top left side of the workbench 1 is fixed with a The left support frame 4, the right support frame 3 is fixed on the right side of the top of the workbench 1, the left support frame 4 is set as an L-shaped plate stru...
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