Semiconductor device trimming device

Abstract

A rib cutting device for semiconductor devices, including: a bottom die, a press die, a material pushing mechanism and a material distributing mechanism. The pressing die is arranged above the bottom die, and a rectangular through hole and a bending cavity are formed between the bottom die and the pressing die, the bending cavity communicates with the rectangular through hole, and the bending cavity is used for shaping and cutting off the pins of the semiconductor. The bottom mold is provided with a feeding groove and a discharging groove. The pushing mechanism includes a pushing plate arranged horizontally on one side of the bottom mold. Two partitions are arranged at intervals on the bottom of the pushing plate. Can move back and forth. The material distribution mechanism is located at the end of the discharge chute. The material distribution mechanism includes a feed plate and a photoelectric switch opposite to the pin position corresponding to the semiconductor. The two sides of the end of the discharge chute are respectively provided with a waste chute and a finished product chute. The feed plate includes U-shaped trough, the U-shaped trough is moved between the discharge chute, the waste chute and the finished product chute. The rib cutting efficiency is high, and the defective products can be preliminarily screened to reduce the workload of the subsequent process.

Description

technical field [0001] The invention belongs to the field of semiconductor production and processing, in particular to a rib cutting device for semiconductor devices. Background technique [0002] Semiconductors usually use multiple pins to install various chips on the lead frame and then form a package on the lead frame, and then cut the package and a section of pins on the overall frame of the semiconductor device to form a single semiconductor. The pins are shaped at the same time in the process, which is called "cutting ribs". Most of the existing rib cutting devices adopt the step-by-step rib trimming method, that is, put the semiconductor device as a whole into the rib trimming equipment, and then cut off the packages on the semiconductor device one by one, resulting in low efficiency; on the other hand, The lead frame used as a semiconductor carrier will inevitably break or fall off during the early production process and when cutting the ribs. Most of these semicond...

AI Technical Summary

Problems solved by technology

Most of the existing rib cutting devices adopt the step-by-step rib trimming method, that is, put the semiconductor device as a whole into the rib trimming equipment, and then cut off the packages on the semiconductor device one by one, resulting in low efficiency; on the other hand, The lead frame used as a semiconductor carrier will inevitably break or fall off during the early production process and when cutting the ribs. Most of these semiconductors are defective products, and the existing rib cutting device cannot perform preliminary inspection on this part of the semiconductor. Identification, resulting in the mixing of defective products and qualified products, increasing the workload of detection in the subsequent process

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