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Reactive organic silicon thixotropic agent, organic silicon packaging adhesive and LED element

A reactive silicone and thixotropic agent technology, which is applied in the direction of electrical components, adhesives, electrical solid devices, etc., can solve the problems of easy turbidity of packaged products, poor compatibility, and difficulty in obtaining high transparency

Active Publication Date: 2021-06-18
BEIJING KMT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these silicone thixotropic agents can improve the thixotropic stability of silicone encapsulants after being combined with fillers, their compatibility with the silicone encapsulant matrix (especially the matrix containing phenyl groups) is often poor, resulting in poor packaging products. It is easy to turbid, it is difficult to obtain ideal high transparency, and its addition is usually not conducive to improving the mechanical properties and adhesive properties of silicone encapsulants

Method used

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  • Reactive organic silicon thixotropic agent, organic silicon packaging adhesive and LED element
  • Reactive organic silicon thixotropic agent, organic silicon packaging adhesive and LED element

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preparation example Construction

[0103]

[0104] The present invention also provides a method for preparing the reactive silicone thixotropic agent, which includes: making the cyclic hydrogen-containing polysiloxane or the branched hydrogen-containing polysiloxane and the unsaturated polyether , under the condition that the ratio of the total amount of SiH bonds in the cyclic hydrogen-containing polysiloxane or the branched hydrogen-containing polysiloxane to the total amount of ethylenic bonds in the unsaturated polyether is greater than 1, carry out Hydrosilylation reaction.

[0105] In order to promote the smooth progress of the reaction, in the present invention, the hydrosilylation reaction is preferably carried out in the presence of a hydrosilylation reaction catalyst. In the present invention, there is no particular limitation on the type of the hydrosilylation reaction catalyst, and a known type in the art can be used. Examples of the hydrosilylation reaction catalyst include, but are not limited ...

Embodiment 1 to 3 and comparative example 1 to 2

[0216] The raw materials that embodiment of the present invention 1~3 and comparative example 1~2 use are as follows:

[0217] Organopolysiloxane (A): an organopolysiloxane having a structure represented by the following formula (4-1), having a phenyl group content of 20.9% by weight and a vinyl group content of 1.92 mmol / g.

[0218] (Me 2 ViSiO 1 / 2 ) 0.34 (Me 2 SiO 2 / 2 ) 0.2 (MeSiO 3 / 2 ) 1.02 (PhSiO 3 / 2 ) 0.48 (4-1)

[0219] Hydrogen-containing polysiloxane (B): a hydrogen-containing polysiloxane having a structure represented by the following formula (5-1).

[0220] (Me 2 HSio 1 / 2 ) 2 (Ph 2 SiO 2 / 2 ) 1 (5-1)

[0221] Hydrosilylation reaction catalyst (C): platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex (platinum content: 0.5 wt%).

[0222] Filler (D): fumed silica, particle size 14nm, BET specific surface area 230m 2 / g.

[0223] Reactive tackifier (E1): prepared in Synthesis Example 1.

[0224] Reactive tackifier (E2): prepared in Synthe...

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Abstract

The invention discloses a reactive organic silicon thixotropic agent, an organic silicon packaging adhesive containing the reactive organic silicon thixotropic agent and an LED element packaged by the organic silicon packaging adhesive. According to the invention, phenyl-containing cyclic hydrogen-containing polysiloxane or branched hydrogen-containing polysiloxane and unsaturated polyether are subected to hydrosilylation to prepared a reactive organic silicon thixotropic agent under the condition that the ratio of the total amount of SiH bonds in the cyclic hydrogen-containing polysiloxane or branched hydrogen-containing polysiloxane to the total amount of olefinic bonds in the unsaturated polyether is greater than 1, the reactive organic silicon thixotropic agent can endow the organic silicon packaging adhesive with stable thixotropic property, high transparency and excellent mechanical property and bonding property at the same time, and an LED element with excellent packaging property is manufactured from the reactive organic silicon thixotropic agent.

Description

technical field [0001] The present invention relates to an organic silicon thixotropic agent, in particular to a reactive organic silicon thixotropic agent, and to an organic silicon encapsulant containing the reactive organic silicon thixotropic agent, and an LED element encapsulated by the organic silicon encapsulant . Background technique [0002] In recent years, with the rapid growth of market demand for ultra-high-definition TVs and high-end displays, new LED display technologies such as mini LED and micro LED have developed rapidly. When encapsulating such LED components, in order to facilitate processing, it is usually necessary to use a thixotropic silicone encapsulant to ensure that the silicone encapsulant can be directly molded, and the shape remains basically unchanged before and after encapsulation and curing. [0003] Usually, fillers such as silicon dioxide, carbon black, and organic bentonite can be added to the silicone encapsulant to obtain suitable thixo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/46C09J183/07C09J183/05C09J11/04H01L33/56
CPCC08G77/46C09J183/04C09J11/04H01L33/56C08L2205/025C08L2205/03C08L83/04C08L83/12C08K3/36C08G77/12C08G77/38C08G77/20C09D183/04C08K5/06C08K5/56C08L71/02C08L83/00C08K3/22C08G77/80C08K3/013C09K3/10C08K2201/005C08K2201/006H10K50/84
Inventor 邓祚主马静刘慧娟
Owner BEIJING KMT TECH
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