Super-pixel-based flexible IC substrate color change defect detection method and device

A defect detection and super pixel technology, applied in the field of image processing, can solve the problems of misjudgment of discoloration defects and excessive discoloration area.

Active Publication Date: 2021-06-18
SOUTH CHINA UNIV OF TECH +1
View PDF9 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The first purpose of the present invention is to overcome the shortcomings and deficiencies of the prior art, and provide a method for detecting discoloration defects of flexible IC substrates based on superpixels, which can quickly, accurately and comprehensively extract discoloration defects in flexible IC substrates, Avoid misjudgment of discoloration defects due to discoloration defects located at the edge or too large a discoloration area

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Super-pixel-based flexible IC substrate color change defect detection method and device
  • Super-pixel-based flexible IC substrate color change defect detection method and device
  • Super-pixel-based flexible IC substrate color change defect detection method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] This embodiment discloses a method for detecting discoloration defects of flexible IC substrates based on superpixels, which can be executed by smart devices such as computing, such as figure 1 shown, including steps:

[0079] Step S1. Acquire the source image of the flexible IC substrate to detect discoloration defects; in this embodiment, the source image of the flexible IC substrate is obtained by shooting the flexible IC substrate within the range of a microscope, the microscope is a metallographic microscope, and the magnification of the objective lens used is 20 times, specifically, it can be shot with an industrial CCD camera and a white light source is selected.

[0080] Step S2, preprocessing the source image of the flexible IC substrate. In this example, if figure 2 As shown in , the process of preprocessing the flexible IC substrate source image in step S2 is as follows:

[0081] Step S21. Firstly, the median filtering method is used to perform denoising ...

Embodiment 2

[0129] This embodiment discloses a superpixel-based flexible IC substrate discoloration defect detection device, including:

[0130] The obtaining module is used to obtain the source image of the flexible IC substrate to be detected for discoloration defects.

[0131] The preprocessing module is used for preprocessing the source image of the flexible IC substrate.

[0132] The segmentation module is used to segment the superpixel image on the preprocessed image. The specific segmentation steps are as shown in steps S31 to S35 of Embodiment 1, which need not be repeated here.

[0133] The judging module is used to input the superpixel image obtained after segmentation into an energy function to judge the discoloration defect of the flexible IC substrate. The specific judging process is as in step S41 to step S43.

[0134] In this embodiment, the preprocessing module includes:

[0135] The denoising processing module is used to perform denoising processing on the source image ...

Embodiment 3

[0140] This embodiment discloses a storage medium, which stores a program. When the program is executed by a processor, the superpixel-based flexible IC substrate discoloration defect detection method described in Embodiment 1 is implemented, as follows:

[0141] Acquire a source image of the flexible IC substrate to detect discoloration defects;

[0142] Preprocessing the flexible IC substrate source image;

[0143] Perform superpixel image segmentation on the preprocessed image;

[0144] The superpixel image obtained after segmentation is input into the energy function to determine the discoloration defect of the flexible IC substrate.

[0145] In the above process, the specific processing process is as described in Embodiment 1, and will not be repeated here.

[0146] In this embodiment, the storage medium may be a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a U disk, a ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a super-pixel-based flexible IC substrate color change defect detection method and device. The method comprises the following steps: acquiring a flexible IC substrate source image of which the color change defect needs to be detected; preprocessing the flexible IC substrate source image; and inputting a superpixel image obtained after segmentation into an energy function to judge the color change defect of the flexible IC substrate. According to the method, for the flexible IC substrate source image of which the defect needs to be detected and the image of which the ROI area is extracted after preprocessing, super-pixel image segmentation is carried out, the color change defect of the flexible IC substrate is judged through an energy function on the basis of the super-pixel image obtained through segmentation, the color change defect in the flexible IC substrate can be rapidly, accurately and comprehensively extracted, and the defect detection accuracy of the flexible IC substrate is improved. And the phenomenon of misjudgment of the discoloration defect caused by the discoloration defect located at the edge or an overlarge discoloration area is avoided.

Description

technical field [0001] The invention relates to an image processing method, in particular to a method and device for detecting discoloration defects of a flexible IC substrate based on superpixels. Background technique [0002] During the processing, storage and transportation of high-density flexible IC substrates, especially during the etching or copper plating process, the appearance of the substrate may be corroded by other colors due to staff mistakes, and in severe cases it may even affect the integrated circuit. service life and functionality. The detection of appearance discoloration defects (including discoloration caused by oxidation, ink, and adhesion of colored substances) is usually performed by mapping the image to the HSV color space, and then performing morphological processing and extraction of specific color areas of the image. For the image where the defect outline is completely inside the appearance gold surface, this method can quickly and accurately lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06T7/00G06T7/90G06T7/11G06T7/136G06T7/187
CPCG06T7/0006G06T7/90G06T7/11G06T7/136G06T7/187G06T2207/10024G06T2207/30148
Inventor 胡跃明程艳
Owner SOUTH CHINA UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products