MEMS sensor and packaging structure thereof

Abstract

The invention discloses an MEMS sensor and a packaging structure thereof, and the packaging structure comprises: a shell which is provided with a first substrate, a second substrate and a connecting plate for connecting the first substrate and the second substrate, wherein the inner surface of the first substrate, the inner surface of the second substrate and the inner surface of the connecting plate form a cavity, the first substrate and the second substrate respectively extend from the top surface of the shell to the bottom surface of the shell, and the inner surface of the first substrate and / or the inner surface of the second substrate are / is provided with a conductive region; at least one electrode which is located outside the cavity and arranged on the bottom surface of the shell, wherein the bottom surface of the shell at least comprises one outer surface of the connecting plate; and at least one conductive structure which is used for electrically connecting the electrodes to the corresponding conductive regions through the first substrate and / or the second substrate respectively. According to the packaging structure, the wiring of the MEMS sensor is simplified, the reliability of the MEMS sensor is further improved, the complexity of the technological process is reduced, and the cost is reduced.

Description

technical field [0001] The present application relates to the technical field of MEMS sensors, and more specifically, to microphones, pressure sensors, bone conduction and packaging structures thereof. Background technique [0002] Sensors based on micro-electromechanical systems (Micro Electro Mechanical Systems, MEMS) are called MEMS sensors, and MEMS sensors are valued due to their extremely small size and good performance. MEMS sensors usually include a micro-electromechanical structure chip and a signal processing chip electrically connected to the micro-electro-mechanical structure. In order to prevent the chip from being broken and reduce the interference of the environment on the chip, it is necessary to protect the micro-electro-mechanical structure chip and signal in the MEMS sensor by setting a packaging structure. The processing chip also needs to form an electrical connection between the signal processing chip and the outside world through a packaging structure....

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Problems solved by technology

[0004] However, since the micro-electromechanical structure chip 4, the signal processing chip 5 and the filter capacitor 6 are all fixed on the upper substrate 1, the area occupied by the upper substrate 1 is relatively large, and the MEMS sensor is installed on the upper substrate 1, the connecting board 2 and the lower substrate 1. More conductive columns are set in the substrate 3, which makes the layout of the wiring for transmitting the output signal more complicated, and there is more interference between the wiring, thereby reducing the reliability of the MEMS sensor, increasing the complexity of the process, and improving the reliability of the MEMS sensor. cost

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