A kind of high thermal conductivity and high resilience thermal conductivity silica gel pad and preparation method thereof
A heat-conducting silica gel and high-resilience technology, which is applied in chemical instruments and methods, heat exchange materials, etc., can solve the problems of stress relaxation, resilience and sealing reduction of heat-conducting silica gel pads, so as to improve the filling effect and enhance the resilience , Good heat conduction effect
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Embodiment 1
[0039] A thermally conductive silicone pad with high thermal conductivity and high resilience, made of the following raw materials in parts by weight: 180g composite silicone oil, 2030g thermal conductive filler, 9g crosslinking agent, 1.2g curing agent, and 17g silicone color masterbatch. Composite silicone oil is made by mixing silicone oil A and silicone oil B with a weight ratio of 9:11. Silicone oil A is methyl vinyl silicone oil with a viscosity of 100cps, and silicone oil B is phenylvinyl silicone oil with a viscosity of 1000cps; the thermal conductive filler is determined by weight ratio It is formed by mixing alumina powder A and alumina powder B at 38:3, the particle size of alumina powder A is 10 μm, and the particle size of alumina powder B is 5 μm; the crosslinking agent is a commonly used crosslinking agent in this field. In this embodiment, polymethylhydrogen siloxane is selected; the curing agent is a commonly used curing agent in this field; the silica gel colo...
Embodiment 2
[0045] A thermally conductive silicone pad with high thermal conductivity and high resilience, made of the following raw materials in parts by weight: 200g composite silicone oil, 2050g thermal conductive filler, 9.8g crosslinking agent, 1.4g curing agent, and 17.5g silicone color masterbatch. Composite silicone oil is made by mixing silicone oil A and silicone oil B with a weight ratio of 9:11. Silicone oil A is methyl vinyl silicone oil with a viscosity of 100cps, and silicone oil B is phenylvinyl silicone oil with a viscosity of 1000cps; the thermal conductive filler is determined by weight ratio It is formed by mixing alumina powder A and alumina powder B at 38:3, the particle size of alumina powder A is 10 μm, and the particle size of alumina powder B is 5 μm; the crosslinking agent is a commonly used crosslinking agent in this field. In this embodiment, polymethylhydrogensiloxane is selected, and the curing agent is a commonly used curing agent in the field.
[0046] The...
Embodiment 3
[0051] A thermally conductive silicone pad with high thermal conductivity and high resilience, made of the following raw materials in parts by weight: 210g composite silicone oil, 2070g thermal conductive filler, 10g crosslinking agent, 1.7g curing agent, and 17.8g silicone color masterbatch. Composite silicone oil is made by mixing silicone oil A and silicone oil B with a weight ratio of 9:11. Silicone oil A is methyl vinyl silicone oil with a viscosity of 100cps, and silicone oil B is phenylvinyl silicone oil with a viscosity of 1000cps; the thermal conductive filler is determined by weight ratio It is formed by mixing alumina powder A and alumina powder B at a ratio of 38:4, the particle size of alumina powder A is 10 μm, and the particle size of alumina powder B is 5 μm; the crosslinking agent is a commonly used crosslinking agent in the field. In this embodiment, polymethylhydrogensiloxane is selected, and the curing agent is a commonly used curing agent in the field.
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Abstract
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