A binding method of capacitive screen

Abstract

The invention discloses a binding method of a capacitive screen. The binding method of the capacitive screen includes the following steps: stacking the touch layer, the conductive adhesive layer and the printed circuit board in sequence; wherein, the end of the touch layer is provided with a welding area, and the gold fingers on the printed circuit board pass through the conductive adhesive The contact layer is in contact with the welding area of ​​the touch layer; the hot pressing tool head is used to perform hot pressing treatment on the welding area of ​​the gold finger, the conductive adhesive layer and the touch layer; wherein, the width of the hot pressing tool head is smaller than the length of the gold finger, and the hot pressing The cutter head includes a first edge and a second edge arranged oppositely, the first edge is close to the outer edge of the golden finger, the second edge is close to the inner edge of the golden finger, and the first edge and the outer edge of the golden finger maintain a first distance. The embodiment of the present invention can realize the accurate alignment of the hot-pressing cutter head, thereby reducing the probability that the material in the welding area of ​​the capacitive screen touch layer is fractured by the cutter head and delaminated during hot-pressing binding.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of capacitive screens, and in particular, to a method for binding capacitive screens. Background technique [0002] With the development of related technologies, capacitive screens, especially capacitive touch screens, have more and more application scenarios, such as household appliances, wearable products, and industrial control equipment. The capacitive touch screen mainly relies on the sensing device integrated in its own touch function film layer to collect electromagnetic changes and signal changes, and then feedback the touch information through the calculation processing of the touch circuit board. Therefore, in the preparation process of the capacitive screen, it is necessary to bind the sensor film layer in the capacitive screen and the touch circuit board. However, in the prior art, there is a problem of poor alignment of the hot-pressing cutter head, which may cause the mat...

AI Technical Summary

Problems solved by technology

However, in the prior art, there is a problem of poor alignment of the hot-pressing cutter head, which will cause the material in the welding area of ​​the touch layer of the capacitive screen to be crushed by the cutter head, resulting in delamination.

Images