Substrate, applicable manufacturing method thereof, and power module

A manufacturing method and substrate technology, which are applied in the direction of output power conversion device, inductor/transformer/magnet manufacturing, conversion of DC power input to DC power output, etc., can solve the problem that high efficiency, high power density and high heat dissipation capacity cannot be further achieved and other problems to achieve the effect of solving electromagnetic interference, reducing connection impedance, and reducing thickness

Pending Publication Date: 2021-06-22
DELTA ELECTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with the advancement of technology, the independent optimization of a single component has gradually reached the extreme, and it is impossible to further achieve high efficiency, high power density and high heat dissipation capacity

Method used

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  • Substrate, applicable manufacturing method thereof, and power module
  • Substrate, applicable manufacturing method thereof, and power module
  • Substrate, applicable manufacturing method thereof, and power module

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Embodiment Construction

[0114] Some typical embodiments embodying the features and advantages of the present disclosure will be described in detail in the description in the following paragraphs. It should be understood that the disclosure is capable of various changes in different embodiments without departing from the scope of the disclosure, and that the description and drawings therein are illustrative in nature and not limiting. This disclosure.

[0115] The inventive concept of the present disclosure is a substrate including a first insulating layer, at least one passive element, at least a first through hole, a second insulating layer and a second electrode. The first insulating layer includes an upper surface and a lower surface. The passive element is embedded in the first insulating layer and has a first conducting terminal. The first through hole is formed in the first insulating layer adjacent to one side of the passive element and penetrates the first insulating layer, wherein the firs...

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PUM

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Abstract

The invention provides a substrate, an applicable manufacturing method thereof and a power module. The substrate comprises a first insulating layer, a passive element, a first through hole, a second insulating layer and a second electrode. The first insulating layer has an upper surface and a lower surface. The passive element is embedded in the first insulating layer and is provided with a first conductive connection end; the first through hole is formed in the first insulating layer and penetrates through the first insulating layer, the first through hole comprises a conductive part and an insulating part arranged in the conductive part, and the conductive part of the first through hole is connected with the first conductive connection end to form a first electrode; the second insulating layer is arranged below the conductive part at one end, close to the lower surface of the first insulating layer, of the first through hole; the second electrode is at least partially arranged below the second insulating layer and is in contact with the lower surface of the first insulating layer; wherein the projection of the second electrode and the projection of the first electrode are at least partially overlapped in the direction perpendicular to the upper surface, and the second electrode is different from the first electrode.

Description

technical field [0001] The disclosure relates to a substrate, in particular to a substrate with passive components embedded in an insulating layer, which can reduce the overall thickness and improve the heat dissipation effect, and its applicable manufacturing method and power module. Background technique [0002] With the improvement of human intelligent life requirements, the improvement of intelligent product manufacturing requirements, and the rise of the Internet of Things, the society's demand for information transmission and data processing is also increasing. Among them, for a centralized data processing center, the server is the most important key unit, and the motherboard of this type of server is usually composed of a central processing unit (CPU), chipsets (Chipsets), memory and other data processing digital chips and It is composed of power supply and necessary peripheral components. However, with the improvement of server processing capacity per unit volume, i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H02M1/00H02M3/155H02M3/158
CPCH01L25/16H02M1/00H02M3/155H02M3/158H02M3/1584H02M1/0064H02M3/003H01F27/292H01F27/022H01F27/324H01F41/125H02M3/06
Inventor 洪守玉陈庆东邹欣张明准黄娇平周锦平
Owner DELTA ELECTRONICS (SHANGHAI) CO LTD
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