Temperature influence testing device for computer mainboard

A technology for computer motherboards and testing devices, which is applied in measuring devices, electronic circuit testing, measuring electricity and other directions, can solve the problems of difficult motherboard temperature, maintenance, cumbersome and inconvenient installation process, etc., and achieves fast and simple installation process, improved accuracy, fast The effect of easy installation

Pending Publication Date: 2021-06-25
彭伟
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When performing temperature-affected performance tests on the main board, the main board needs to be fixed and kept warm. However, in order to ensure the temperature near the main board, the existing test device needs to install the main board inside the device, which makes the installation process cumbersome and inconvenient. If it is installed outside the device Mainboard, it will be difficult to maintain the temperature near the mainboard, which will affect the accuracy of the test results. Therefore, in order to solve the above problems, the application proposes a temperature influence test device for computer mainboards.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Temperature influence testing device for computer mainboard
  • Temperature influence testing device for computer mainboard
  • Temperature influence testing device for computer mainboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0041] Example: Reference Figure 1-8 A temperature influence test device for a computer mainboard is shown, comprising an incubator 1, a turning hole is opened on the top of the keeping box 1, and a turning mounting plate 2 is arranged in the turning hole, and the two sides of the turning mounting plate 2 are respectively fixedly connected with short The rotating shaft 3 and the long rotating shaft 4, the overturning mounting plate 2 can make any flat plate in the prior art, such as a metal flat plate attached with an insulating layer, the short rotating shaft 3 and the long rotating shaft 4 can be any straight rod in the prior art, For example metal straight bar, short rotating shaft 3 and long rotating shaft 4 all can be fixedly connected with the both sides of overturning mounting plate 2 respectively by the mode of welding, and the top of incubator 1 is fixedly connected with short rotating drum 5 and long rotating drum 6, and short rotating shaft 3. One end of the long r...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a temperature influence testing device for a computer mainboard, and relates to the technical field of mainboard testing devices. The device comprises a heat preservation box, wherein a turnover hole is formed in the top of the heat preservation box, a turnover mounting plate is arranged in the turnover hole, and the two sides of the turnover mounting plate are fixedly connected with a short rotating shaft and a long rotating shaft respectively; wherein the top of the heat preservation box is fixedly connected with a short rotating cylinder and a long rotating cylinder, one end of the short rotating shaft and one end of the long rotating shaft are rotationally connected into the short rotating cylinder and the long rotating cylinder respectively, and one end of the long rotating shaft is fixedly connected with a first rotating handle. According to the invention, after the mainboard is installed, the first rotating handle can be rotated to turn the mainboard into the heat preservation box, so that continuous operation of external installation and internal testing is realized, rapid installation can be realized, internal heat preservation can be carried out during testing, and the testing accuracy is improved; besides, the situation that negative effects are generated between heat preservation work and installation work can be effectively avoided.

Description

technical field [0001] The invention relates to the technical field of main board testing devices, in particular to a temperature influence testing device for a computer main board. Background technique [0002] Computer motherboards, also known as motherboards and system boards, are divided into two types: commercial motherboards and industrial motherboards. The motherboard is installed in the chassis and is one of the most basic and important components of the computer. The main circuit system of the motherboard generally includes components such as BIOS chip, I / O control chip, key and panel control switch interface. test. [0003] When performing temperature-affected performance tests on the main board, the main board needs to be fixed and kept warm. However, in order to ensure the temperature near the main board in the existing test device, the main board needs to be installed inside the device, which makes the installation process cumbersome and inconvenient. If it is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01R31/28
CPCG01R31/282G01R31/2875
Inventor 彭伟
Owner 彭伟
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products