Design and assembly method for heat conduction structure of digital board card
A technology of heat conduction structure and assembly method, applied in the direction of electrical digital data processing, computer aided design, calculation, etc., can solve the problems of obtaining the total contact thermal resistance of the contact surface, measuring easily scratched printed boards, and not considering thermal resistance, etc. , to achieve good accuracy, reduce measurement error and high precision
Active Publication Date: 2021-06-25
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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Problems solved by technology
At present, the vernier caliper is often used as a measuring tool, which is easy to scratch the printed board and the measurement is inaccurate
In addition, the thermal resistance data provided by the thermal pad manual is the thermal resistance of the thermal pad material itself, and does not take into account the thermal resistance caused by the air gap between the thermal pad, the heating device and the heat sink.
Therefore, in high-precision heat transfer control, it is impossible to directly obtain the total contact thermal resistance of the contact surface
Method used
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[0028] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0029] A digital board cartridge guide structure design and assembly method, where image 3 As shown, the thermally conductive structure of the digital plate 3 is thermally conductive plate 5 having a thermally conductive boss 6 corresponding to each IC chip 4 of the digital plate 3, between the thermal conductive boss 6 and the IC chip 4. A heat transfer pad 7 is provided.
[0030] The method specifically includes the following steps:
[0031] (1) Place the digital board level and fixed, with the origin of the IC chip on the surface of the digital board, figure 1 The PMT ARM Portable Measurement Machine 2 shown by Past Technology (Suzhou) Co., Ltd. 2 sequentially measures the height of each IC chip on the digital board. i (see Figure 4 ), I is the number of IC chips;
[0032] (2) Requirement of heat transfer temperature d...
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The invention discloses a design and assembly method for a heat conduction structure of a digital board card, and belongs to the technical field of heat dissipation of electronic equipment. The method comprises the following steps: firstly, measuring the height of each IC chip on the digital board card, selecting a heat-conducting pad, then calculating the design height of a heat-conducting boss, and designing a fastening screw hole near each heat-conducting boss so as to process a heat-conducting plate; A pressure sensor is installed between the IC chip and the heat conduction boss, a torque wrench is adopted to lock the fastening screws, and the torque value of each fastening screw is recorded when the reading of the pressure sensor is equal to the preset pressure; And finally, each pressure sensor is dismounted, each fastening screw is tightened according to the torque value, and the assembly of the digital board card heat conduction structure is completed. The method is simple and easy to implement, the heat transfer temperature difference can be flexibly adjusted through the model selection and thickness of the heat conduction pad and the locking degree of the fastening screws, high-precision control over the heat transfer temperature difference is achieved, the heat transfer efficiency of the heat conduction structure of the digital board card is improved, and efficient operation of the digital board card is guaranteed.
Description
Technical field [0001] The present invention relates to the field of heat dissipation techniques of electronic equipment, and in particular, a digital sheet engaging method design and assembly method. Background technique [0002] With the rapid development of large-scale integrated circuits, the heat of the digital IC chip increases rapidly with the improvement of the intensity, and the temperature control technology and heat dissipation technology have become an important factor in restricting the further development and reliability of IC chips. Current digital board cooling usually uses a metal thermally conductive plate assisted heat dissipation with the same or close to the printed plate size, and the heat of multiple IC chips on the digital board is mainly transmitted to the heat transfer plate by heat transfer, and by the thermally conductive plate Or in the form of liquid is delivered to heat. In order to fit the height of multiple different IC chips on the digital board,...
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IPC IPC(8): G06F30/398G06F30/392
CPCG06F30/398G06F30/392
Inventor 谢明君李姣姣
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP