Liquid ejecting device and circuit board
A technology for circuit substrates and liquid ejection heads, which is applied in the direction of circuit substrate materials, stacked and separated printed circuit boards, inking devices, etc., and can solve problems such as drive circuit misoperation and characteristic degradation
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 approach
[0050] 1.1 Structure of liquid ejection device
[0051] figure 1 It is a diagram showing a schematic configuration of the inside of the liquid ejection device 1 of the present embodiment. The liquid ejection device 1 forms dots on a medium P such as paper by ejecting ink as an example of a liquid based on image data supplied from an externally installed host computer, thereby printing images corresponding to the supplied image data. image for an inkjet printer. In addition, in figure 1 In , the illustration of a part of the structure of the liquid ejection device 1 such as the case and the cover is omitted.
[0052] Such as figure 1As shown, the liquid ejection device 1 includes a moving mechanism 3 for moving the print head unit 2 in the main scanning direction. The moving mechanism 3 has: a carriage motor 31 as a driving source of the print head unit 2; a carriage guide shaft 32 whose both ends are fixed; Timing belt 33. In addition, the moving mechanism 3 includes a ...
no. 2 approach
[0199] In the liquid ejection device 1 and the drive signal output circuit boards 40a and 40b in the second embodiment, an insulating layer, a wiring layer, and a protective layer are laminated on both surfaces of the base material 491 of the wiring board 400. The liquid ejection device 1 according to one embodiment is different from the drive signal output circuit boards 40 a and 40 b.
[0200] Figure 16 It is a diagram for explaining the structure of the wiring board 400 in the second embodiment.
[0201] Such as Figure 16 As shown, the wiring substrate 400 in the second embodiment includes a base material 491, insulating layers 492-1, 492-2, wiring layers 493-1, 493-2, and protective layers 494-1, 494-2. In addition, an insulating layer 492-1, a wiring layer 493-1, and a protective layer 494-1 are laminated on the surface 495 side of the substrate 491, and an insulating layer 492-2, wiring layer 493-1 are laminated on the surface 496 side of the substrate 491. 2 and pr...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 


