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Liquid ejecting device and circuit board

A technology for circuit substrates and liquid ejection heads, which is applied in the direction of circuit substrate materials, stacked and separated printed circuit boards, inking devices, etc., and can solve problems such as drive circuit misoperation and characteristic degradation

Active Publication Date: 2021-06-29
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The heat generated in such a drive circuit may degrade the characteristics of the components constituting the drive circuit, or cause malfunction of the drive circuit due to the deterioration of the characteristics.
That is, there is room for improvement from the viewpoint of efficiently releasing heat generated in the drive circuit

Method used

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  • Liquid ejecting device and circuit board
  • Liquid ejecting device and circuit board
  • Liquid ejecting device and circuit board

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0050] 1.1 Structure of liquid ejection device

[0051] figure 1 It is a diagram showing a schematic configuration of the inside of the liquid ejection device 1 of the present embodiment. The liquid ejection device 1 forms dots on a medium P such as paper by ejecting ink as an example of a liquid based on image data supplied from an externally installed host computer, thereby printing images corresponding to the supplied image data. image for an inkjet printer. In addition, in figure 1 In , the illustration of a part of the structure of the liquid ejection device 1 such as the case and the cover is omitted.

[0052] Such as figure 1As shown, the liquid ejection device 1 includes a moving mechanism 3 for moving the print head unit 2 in the main scanning direction. The moving mechanism 3 has: a carriage motor 31 as a driving source of the print head unit 2; a carriage guide shaft 32 whose both ends are fixed; Timing belt 33. In addition, the moving mechanism 3 includes a ...

no. 2 approach

[0199] In the liquid ejection device 1 and the drive signal output circuit boards 40a and 40b in the second embodiment, an insulating layer, a wiring layer, and a protective layer are laminated on both surfaces of the base material 491 of the wiring board 400. The liquid ejection device 1 according to one embodiment is different from the drive signal output circuit boards 40 a and 40 b.

[0200] Figure 16 It is a diagram for explaining the structure of the wiring board 400 in the second embodiment.

[0201] Such as Figure 16 As shown, the wiring substrate 400 in the second embodiment includes a base material 491, insulating layers 492-1, 492-2, wiring layers 493-1, 493-2, and protective layers 494-1, 494-2. In addition, an insulating layer 492-1, a wiring layer 493-1, and a protective layer 494-1 are laminated on the surface 495 side of the substrate 491, and an insulating layer 492-2, wiring layer 493-1 are laminated on the surface 496 side of the substrate 491. 2 and pr...

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PUM

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Abstract

The present invention provides a liquid ejection device capable of efficiently releasing heat generated in a drive circuit, the device comprising: a liquid ejection head that has a drive element and ejects liquid by supplying a drive signal to the drive element; and a drive circuit that outputs the drive signal, the drive circuit being provided with: a modulation circuit that modulates a source drive signal and outputs a modulated signal; an amplification circuit that amplifies the modulated signal and outputs an amplified modulated signal; a demodulation circuit that demodulates the amplified modulation signal and outputs the drive signal; and a substrate on which the modulation circuit, the amplification circuit, and the demodulation circuit are provided, the substrate including a base material and a first layer laminated on a first surface of the base material, the base material containing metal, the first layer including a first transmission wiring through which at least one of the amplification modulation signal and the drive signal is transmitted, and the thickness of the base material being thicker than the thickness of the first layer.

Description

technical field [0001] The present invention relates to a liquid ejection device and a circuit board. Background technique [0002] Among inkjet printers that print images or documents on media by ejecting liquid ink, for example, inkjet printers using piezoelectric elements such as piezo elements are known. The piezoelectric elements are respectively provided corresponding to the plurality of nozzles in the print head unit. Then, by operating each piezoelectric element in accordance with the drive signal, a predetermined amount of ink is ejected from the corresponding nozzle at a predetermined timing. Thereby, ink dots are formed on the medium. From an electrical point of view, such a piezoelectric element is a capacitive load such as a capacitor, and therefore, a sufficient current needs to be supplied to operate the piezoelectric element corresponding to each nozzle. [0003] In order to supply a sufficient current for operating the piezoelectric element, the drive cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B41J2/045
CPCB41J2/04541B41J2/04588B41J2/04581H03K7/08H05K1/05H05K2201/042H05K1/141H05K2201/10189H05K2201/10303H03K17/145H03K2217/0081B41J2/04593B41J2/04596B41J2002/14491B41J2/14201B41J2202/08B41J2202/13
Inventor 野泽大近藤阳一郎
Owner SEIKO EPSON CORP