Integrated packaging display module, repair method thereof and display device

A display module, integrated packaging technology, applied in the direction of identification devices, instruments, electrical components, etc., can solve the problems affecting the display effect and so on

Active Publication Date: 2021-06-29
UNILUMIN GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to provide an integrated packaging display module, its repair method, and a display device for the problem that the color change of the colloid after repairing local dead pixels of the integrated packaging display module affects the display effect.

Method used

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  • Integrated packaging display module, repair method thereof and display device
  • Integrated packaging display module, repair method thereof and display device
  • Integrated packaging display module, repair method thereof and display device

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Embodiment Construction

[0027] In order to make the above-mentioned purpose, features and advantages of the present application more obvious and understandable, the specific implementation manners of the present application will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0028] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" a...

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Abstract

The invention relates to an integrated packaging display module, a repair method thereof and a display device. The repair method of the integrated packaging display module comprises the following steps: thinning the overall glue face of the integrated packaging display module by a preset thickness; removing the colloid at the dead pixel at a fixed point; carrying out repair processing on the dead pixel; and carrying out glue sealing treatment on the whole surface of the integrated packaging display module. A repairing three-step method of first thinning, then hole filling and finally restoring is ingeniously designed, the method is particularly suitable for the integrated packaging display module which is more and more dense and even has the dot spacing smaller than 1 mm, repairing treatment is achieved in a very small limited space, and the overall display effect of the integrated packaging display module can be better guaranteed in cooperation with glue sealing on the whole face after thinning is conducted, so the problem of integrated packaging repair feasibility is solved, the repair reliability and the consistency of appearance color after repair are ensured, the repair efficiency and the overall display stability are improved, and reparable and large-scale mass production of the integrated packaging display module is realized.

Description

technical field [0001] The application relates to the field of small-pitch LED displays, in particular to an integrated packaging display module, a repair method thereof, and a display device. Background technique [0002] With the development of indoor small-pitch LED display technology, in order to achieve smaller pixel pitch and higher reliability requirements, integrated packaged indoor small-pitch LED display products emerged as the times require, integrated packaged indoor small-pitch LED display products One way is to apply COB (Chip On Board, chip on board) light source. COB light source is a high-efficiency integrated surface light source technology that directly pastes LED chips on a mirror metal substrate with high reflectivity. This technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no SMT process, so the process is reduced by nearly 30% One, the cost is also saved by one-third. The COB process is first to cover the place...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/52H01L25/16G09F9/33
CPCH01L33/48H01L33/52H01L25/167G09F9/33H01L2933/0033H01L2933/005
Inventor 胡新喜孙天鹏张金刚张世诚
Owner UNILUMIN GRP
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