Laser forming method of flexible circuit board

A flexible circuit board and laser technology, applied to the formation of electrical connection of printed components, printed circuit, printed circuit manufacturing, etc., can solve the problems of large bending stress of wiring structure, wiring structure breakage, etc., and achieve the effect of reducing stress and good electrical contact

Pending Publication Date: 2021-07-02
福唐激光(苏州)科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Then, the structure in which the wiring structure is directly arranged between the polymer materials will cause the wiring structure to bear a large bending stress when it is bent, causing the wiring structure to break

Method used

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  • Laser forming method of flexible circuit board
  • Laser forming method of flexible circuit board
  • Laser forming method of flexible circuit board

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Embodiment Construction

[0021] The object of the present invention is to provide a laser forming method of a flexible circuit board, so as to prevent the circuit layer from being damaged by stress during bending, resulting in failure of the flexible circuit board.

[0022] join Figure 1-6 , the laser formation method of conductive column of the present invention, comprises the following steps:

[0023] see figure 1 , provide a flexible polymer sheet 1, the flexible polymer sheet 1 includes a first polymer material, the first polymer material is a flexible material, such as polyethylene terephthalate, polyimide Or polymer materials such as polyethylene naphthalate. The thickness of the flexible polymer sheet 1 may be 1-2 mm, and it may be a prefabricated sheet structure.

[0024] Next, a plurality of first via holes are formed in the flexible polymer sheet 1 , and the first via holes are formed by etching or laser drilling. Fill the first via hole with a metal material to form a plurality of firs...

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PUM

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Abstract

According to a laser forming method of a flexible circuit board provided by the invention, a circuit layer is annealed and ablated by using laser, and a plurality of first through holes are used for supporting to form the suspended state, so that the circuit layer can be completely coated by the protective layer with a relatively large elastic modulus, and the circuit layer can be protected during bending due to the arrangement. Meanwhile, the second through holes are correspondingly formed in the redundant through holes of the first through holes, stress can be reduced, and good electric contact can be achieved.

Description

technical field [0001] The invention relates to the field of packaging and manufacturing semiconductor workpieces, in particular to a laser forming method for a flexible circuit board. Background technique [0002] Flexible circuit boards often use flexible polymer materials to form a wiring structure, and the wiring structure of each layer is electrically interconnected through a through-hole machine, so as to realize the function of being bendable. Then, the structure in which the wiring structure is directly arranged between the polymer materials will cause the wiring structure to bear a large bending stress when it is bent, causing the wiring structure to break. Contents of the invention [0003] Based on solving the above problems, the present invention provides a laser forming method of a flexible circuit board, comprising the following steps: [0004] (1) providing a flexible polymer sheet comprising a first polymer material; [0005] (2) forming a plurality of fi...

Claims

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Application Information

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IPC IPC(8): H05K3/28H05K3/40H05K3/42H05K3/00
CPCH05K3/28H05K3/4038H05K3/42H05K3/00
Inventor 陈洁
Owner 福唐激光(苏州)科技有限公司
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