Injection molding cooling device for circuit board production

Abstract

The invention discloses an injection molding cooling device for circuit board production. The injection molding cooling device for circuit board production structurally comprises a base, a machine body, an access door and a control console. According to the injection molding cooling device for circuit board production,by placing a mold in a cooling bin and sucking air from an air inlet pipe through an air suction pipe, the mold in the cooling bin is effectively cooled;in the air inlet process, the air firstly passes through an air inlet plate and is guided in the air inlet plate by an air guide plate, so that the air can be output through an output pipe after metal particles contained in the air are repeatedly filtered by an air filtering ball for multiple times; and an additional collecting and filtering step is carried out through a collecting head, so that the metal particles contained in the air flowing into the cooling bin are greatly reduced; and meanwhile, a supporting handle is pressed inwards through pressure generated by air flowing, an upward moving handle impacts a movable groove to generate vibration during rebounding so as to shake off metal particles on an adsorption head, and therefore, collection and cleaning are more convenient, and the situation that metal impurities are mixed into the mold to affect the performance of a circuit board is effectively avoided.

Description

technical field [0001] The invention relates to the field of injection molding cooling equipment, in particular to an injection molding cooling device for circuit board production. Background technique [0002] The injection molding device can extrude the hot-melted plastic raw material particles and extrude them into a specific mold to obtain a specific shape, so that the finished product can be used or processed later, and is widely used in various fields. In the injection molding process, in order to obtain a faster cooling and solidification effect, it is necessary to use injection cooling equipment to quickly cool down the plastic in the mold. In the process of cooling the mold for circuit board production, due to the accuracy requirements of the circuit board Higher, so we should try our best to avoid the mixing of impurities to affect the installation and conductivity of the circuit board. Sometimes, in order to install the metal parts on the circuit board faster, inj...

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Problems solved by technology

[0002] The injection molding device can extrude the hot-melted plastic raw material particles and extrude them into a specific mold to obtain a specific shape, so that the finished product can be used or processed later, and is widely used in various fields. In the injection molding process, in order to obtain a faster cooling and solidification effect, it is necessary to use injection cooling equipment to quickly cool down the plastic in the mold. In the process of cooling the mold for circuit board production, due to the accuracy requirements of the circuit board Higher, so we should try our best to avoid the mixing of impurities to affect the installation and conductivity of the circuit board. Sometimes, in order to install the metal parts on the circuit board faster, injection molding will be carried out in the factory where the metal parts are produced. Due to the cutting of metal parts, etc. A lot of metal dust will be generated during the process, so during the cooling process of the cooling device, it is easy to draw the metal dust into the mold at the same time, and it is easy to cause a small part of the metal dust to be incorporated into the plastic circuit board that has not been completely cooled , which in turn causes the circuit board to contain metal impurities, which can easily cause metal impurities to affect the conductivity and accuracy of the metal parts after the metal parts are installed

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