Solder ball manufacturing equipment of wafer packaging chip and processing technology of solder ball manufacturing equipment
A technology of wafer packaging and manufacturing equipment, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., and can solve problems such as defects in solder balls
Active Publication Date: 2021-07-06
金易芯半导体科技(嘉兴)有限公司
View PDF6 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] Aiming at the deficiencies of the prior art, the purpose of the present disclosure is to provide a solder ball manufacturing equipment for wafer-packaged chips and its processing technology, which solves the problem of solder balls near the pouring port after casting in the prior art. There will be defects in the position
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present disclosure with reference to the accompanying drawings in the embodiments of the present disclosure. Apparently, the described embodiments are only some of the embodiments of the present disclosure, not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.
[0038] like figure 1 As shown, a solder ball manufacturing equipment for a wafer package chip includes a base plate 1, and a feed assembly 2 is installed on the upper end of the base plate 1, such as figure 2 As shown, the feeding assembly 2 includes a support frame 21, the support frame 21 is fixedly installed on the upper end of the base plate 1, the upper end of the support frame 21 is fixedly installed with a feed pipe 22, and the upper end...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses solder ball manufacturing equipment of a wafer packaging chip and a processing technology of the solder ball manufacturing equipment, and belongs to the field of solder ball production. The solder ball manufacturing equipment of a wafer packaging chip comprises a fixed mold, a movable mold, a pin rod, a push rod, a pressing mechanism, a locking mechanism and a polishing mechanism. The pin rod is in clearance fit with the interior of the fixed mold to achieve exhausting, and the pin rod is connected with the push rod to achieve demolding of the solder ball. By arranging the pressing mechanism, exhaust in the tin ball casting process is accelerated, air holes are reduced, meanwhile, a finished spherical surface is formed by the pressing block, the fixed mold and the movable mold together, and the roundness of the tin ball is guaranteed; the locking mechanism is arranged, so that the situation that the movable mold and the fixed mold are withdrawn after being closed, and mold closing failure is caused is avoided; the polishing mechanism is arranged below the fixed die, so that burrs on the surface of the solder ball are removed; the solder ball processing technology of the wafer packaging chip comprises the steps of mold closing and feeding, mold opening and discharging and polishing.
Description
technical field [0001] The disclosure belongs to the field of solder ball production, and in particular relates to a solder ball manufacturing equipment for wafer packaged chips and a processing technology thereof. Background technique [0002] With the continuous development of science and technology, it is widely used in tinplate, flux, organic synthesis, chemical production, alloy manufacturing, and the assembly of multiple integrated circuits in the electronics industry. Solder balls play an important role in the packaging process of wafer-level chips. Its important role; most of the solder balls are casted, but in the prior art, the solder balls after casting will have defects near the pouring gate, resulting in unqualified solder balls; [0003] An automatic solder ball casting machine (patent number: 201811089224.9), which realizes the automatic production of solder balls by automatically controlling the inflow of tin liquid and automatically pouring and ejecting sold...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L21/67H01L21/48
CPCH01L21/4814H01L21/67011H01L21/67092H01L24/11H01L24/75H01L2224/1111H01L2224/11602H01L2224/753H01L2224/7555
Inventor 胡弘鹏杨秀缘
Owner 金易芯半导体科技(嘉兴)有限公司