Chip tray changing equipment
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN GRAND INNOSYS CORP
- Publication Date
- 2021-07-16
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor integrated circuit chip swapping, in particular to a chip swapping device. Background technique
[0002] In the production process of semiconductor integrated circuit chips, due to the many links and intricate processes, some chips have been damaged during the production process. If the damaged chips and normal chips are released to the market at the same time, it will definitely cause confusion in the market. Therefore, Before the chip enters the market, the chip needs to be tested. The traditional chip inspection process is a labor-intensive process. The inspectors pick up the chip with tweezers, put it on the testing machine, and then press it manually to obtain the chip data. At present, the traditional chip inspection process is being phased out in the market. The most advanced inspection method is The efficiency of chip detection is greatly improved by simulating the manual detection ...