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A hp-x3 automatic lens chip mounter

A HP-X3, fully automatic technology, applied to mechanical equipment, devices for coating liquid on the surface, connecting components, etc., can solve the problems of inability to automatically change discs, inaccurate recognition accuracy, and low degree of automation, and achieve improved The effect of dispensing efficiency, high precision and high degree of automation

Active Publication Date: 2021-10-26
SHENZHEN BAOCHUANG ELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art, provide a HP-X3 automatic lens chip mounter, solve the problem in the prior art that there is only one-way identification, and the identification accuracy is not accurate enough; solve the problem of swing arm feeding and preset There is a problem of position deviation between positions; solve the problem of inability to automatically change discs and low degree of automation; solve the problem of low dispensing efficiency

Method used

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  • A hp-x3 automatic lens chip mounter
  • A hp-x3 automatic lens chip mounter
  • A hp-x3 automatic lens chip mounter

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Embodiment Construction

[0032] The invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] Please refer to Figure 1 - Figure 11 The present invention provides an HP-X3 automatic lens chip mount machine, including: a rack 1, a dispensing mechanism 2, a patch mechanism 3, a luminance correction component 4, an automatic changing plate The mechanism 5 is disposed on the swing arm assembly 6 on the upper side of the automatic changing mechanism 5; one side of the dispensing mechanism 2 is provided with a dot gel drive assembly 8, and the bottom pin assembly is provided at the bottom of the automatic changing mechanism 5. 7. The first position detecting device 10, the second position detecting device 11, respectively, and the second position detecting device 11 are provided, respectively, and the dot gelatin mechanism 2 is used for the entrainment of the fixtures. Glue; the point glue drive assembly 8 is used to deliver the trigger carrier pla...

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Abstract

The invention discloses an HP-X3 automatic lens chip mounting machine, comprising: a frame, a glue dispensing mechanism, a patch mechanism, an offset correction component, and an automatic disk changing mechanism arranged on the frame. The swing arm assembly on the upper side of the automatic disk changing mechanism; one side of the dispensing mechanism is provided with a dispensing drive assembly, the bottom of the automatic disk changing mechanism is provided with a thimble assembly, and the upper and lower two sides of the offset correction assembly A first position detection device and a second position detection device are respectively provided on the sides. The present invention realizes two-way positioning detection through the cooperation of the first position detection device with the second position detection device, adjusts the position of the wafer through the offset correction component according to the positioning detection result, effectively improves the feeding accuracy and ensures the placement accuracy.

Description

Technical field [0001] The present invention relates to the field of mounting machines, in particular to an HP-X3 automatic lens chip mounting machine. Background technique [0002] The lens chip mounting machine in the prior art has the following problems: 1, only the bottom mirror camera recognition can only be one-way identification, the recognition accuracy is not accurate; 2, when the arms are fed to the patch station, usually There is a positional offset between the preset position, and the position correction device is required, and the positional correction device set in the prior art can only only perform micro-correction, resulting in low feed accuracy; 3, the automatic change of the crystal ring cannot be performed. The disk, the degree of automation is low, and the production efficiency is reduced, and each change is required to shut down, the crash and misuse risk are large; 4, usually only two point glue heads, the spot glue is slow, affecting production efficiency....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C13/02F16B11/00
CPCB05C5/0208B05C5/027B05C13/02F16B11/006
Inventor 刘方照陈大罗刘佳佳周鹏宇郑宇张星星
Owner SHENZHEN BAOCHUANG ELECTRONICS EQUIP CO LTD
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