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A kind of mfs@cnt epoxy resin composite material and preparation method thereof

An epoxy resin and composite material technology, which is applied in the construction of three-dimensional heat conduction paths, can solve the problems of destroying the mechanical properties and processing properties of composite materials, low thermal conductivity, increasing manufacturing costs and filler contact resistance, etc. The effect of improving thermal conductivity and efficient heat

Active Publication Date: 2022-05-31
ANHUI UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Polymer-based materials have great development potential, but the thermal conductivity of most polymers is very low (about 0.2W / (mK), such as epoxy resin)
Using high thermal conductivity fillers to build polymer-based thermal management materials is one of the most effective methods, however, excessive filler content will increase the manufacturing cost and contact resistance between fillers, and damage the mechanical properties and processability of composite materials

Method used

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  • A kind of mfs@cnt epoxy resin composite material and preparation method thereof
  • A kind of mfs@cnt epoxy resin composite material and preparation method thereof
  • A kind of mfs@cnt epoxy resin composite material and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0026] This embodiment prepares EP / MFS-CNT thermally conductive composite material according to the following steps:

[0027] Step 1, alkali modification

[0028] MFS (4×4×2cm) was soaked in 8mol / L NaOH solution for 70min, then washed with water until neutral, and dried under vacuum at 70°C overnight to obtain the modified MFS.

[0029] Step 2. Preparation of MFS@ZIF-67

[0030] 0.8566g Co(NO 3 ) 2 ·6H 2 O and 0.45g polyvinylpyrrolidone were dissolved in 30mL of methanol to obtain solution A;

[0031] Dissolve 1.84 g of 2-methylimidazole in 30 mL of methanol, and add 42 μL of triethylamine to obtain solution B;

[0032] The modified MFS was immersed in solution A, stirred for 30 min, then added dropwise to solution B, and continued to stir for 12 h; the obtained product was washed with methanol, and vacuum-dried at 55°C for 6 h to obtain MFS@ZIF-67.

[0033] Step 3. Preparation of MFS@CNT

[0034] MFS@ZIF-67 was added into a tube furnace, and under the protection of Ar,...

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Abstract

The invention discloses an MFS@CNT epoxy resin composite material and a preparation method thereof. The ZIF-67 crystal is grown in situ on the skeleton of an alkali-modified melamine-formaldehyde sponge MFS, and then the ZIF-67 crystal is carbonized at a high temperature. Converted into carbon nanotubes, and finally vacuum-assisted infiltration with epoxy resin and cured at high temperature to obtain MFS@CNT epoxy resin composites. The invention can remarkably improve the thermal conductivity of the epoxy resin with ultra-low filler content.

Description

technical field [0001] The invention relates to a method for constructing a three-dimensional heat conduction path, in particular to a method for preparing an MFS@CNT epoxy resin composite material. Background technique [0002] With the continuous development of contemporary technology, various electronic devices tend to be high-power, miniaturized and integrated. During use, a large amount of heat will inevitably be generated and remain in the device. If the heat is not removed in time and effectively, it will seriously affect The service life and efficiency of electronic equipment, so the current research on materials with high thermal conductivity has become a top priority. Excellent thermal management materials should have the advantages of high thermal conductivity and easy fabrication. Polymer-based materials have great development potential, but the thermal conductivity of most polymers is very low (0.2W / (mK) or so, such as epoxy resin). The use of high thermal con...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/04C08K3/28
CPCC08K3/041C08K3/28C08L63/00
Inventor 钱家盛潘升军伍斌李亚李旭钱钢张俊丁伯阳李小换
Owner ANHUI UNIVERSITY