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Display module and display device

A display module and main body technology, applied in identification devices, cooling/ventilation/heating transformation, instruments, etc., can solve the problem of poor heat dissipation of D-IC and achieve the effect of improving heat dissipation

Pending Publication Date: 2021-07-16
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, an embodiment of the present invention provides a display module and a display device including the display module to solve the technical problem of poor heat dissipation of the D-IC in the display module existing in the prior art

Method used

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  • Display module and display device
  • Display module and display device
  • Display module and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] Such as figure 1 and 4 As shown, the embodiment of the present invention provides a display module, the display module includes a flexible panel 3, a driver chip 2 and a bending spacer 4, wherein the flexible panel 3 includes a body section 301, a bending section 302 and The connection section 303, the body section 301 and the connection section 303 are arranged side by side; the driver chip 2 is arranged on the side of the body section 301 away from the connection section 303; the curved gasket 4 includes the first thermally conductive glue arranged in sequence 403, a metal layer 404 and a second thermally conductive adhesive 405, the metal layer 404 is connected to the body segment 301 through the first thermally conductive adhesive 403, and the metal layer 404 is connected to the heat dissipation film 5 through the second thermally conductive adhesive 405 For connection, the heat dissipation film 5 is disposed between the connecting section 303 and the second therma...

Embodiment 2

[0047] Such as figure 1 and 5 As shown, the embodiment of the present invention provides a display module, which includes a protective layer 1, a driver chip 2, and a flexible panel 3 that are sequentially stacked. The protective layer 1 includes a first conductive cloth 105, graphite vinyl layer 107 , second conductive cloth 106 , third conductive glue 110 and insulating tape 103 , insulating glue 104 can also be arranged on the surface of insulating tape 103 , and said insulating tape 103 is connected with said driver chip 2 . In the display module of this embodiment, the protective layer 1 on the upper side of the driver chip 2 also adds graphene with higher thermal conductivity to the basic composition of ordinary conductive cloth and insulating glue, and utilizes large-area graphene to drive the The heat generated by the chip 2 is exported and dissipated, thereby improving the cooling effect of the driver chip 2 in the display module. For the protective layer 1, due to ...

Embodiment 3

[0051] Such as Figure 6 As shown, the embodiment of the present invention includes both the improved structure of the curved gasket 4 in the first embodiment and the improved structure of the protective layer 1 in the second embodiment. The display module includes a protective layer 1, a driver chip 2 and a flexible panel 3 that are sequentially stacked. The protective layer 1 includes a first conductive cloth 105, a graphene layer 107, a second conductive cloth 106, a third conductive Glue 110 and insulating tape 103 , insulating glue 104 may also be provided on the surface of the insulating tape 103 , and the insulating tape 103 is connected to the driving chip 2 . The display module also includes a heat dissipation film 5 and a curved gasket 4. The flexible panel 3 includes a body section 301, a bending section 302 and a connection section 303 connected in sequence, and the body section 301 and the connection section 303 are arranged side by side. The driver chip 2 is arr...

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Abstract

The invention relates to the technical field of display equipment, in particular to a display module and a display device comprising the display module. The display module comprises a flexible panel, a driving chip and a bending gasket, the flexible panel comprises a body section, a bending section and a connecting section which are sequentially connected, and the body section and the connecting section are arranged side by side; the driving chip is arranged on one side, deviating from the connecting section, of the body section; the bending gasket comprises first heat-conducting glue, a metal layer and second heat-conducting glue which are sequentially arranged, the metal layer is connected with the body section through the first heat-conducting glue, and the metal layer is connected with the connecting section through the second heat-conducting glue. According to the display module, the base material of the bent gasket is adjusted to be the metal base material, and the heat-conducting glue is matched, so that the fixation of the bent gasket on the bent flexible panel is not influenced, the heat generated by the driving chip is conducted to the heat dissipation film by using the metal with high heat conductivity coefficient through the change of the base material, and the heat dissipation effect of the driving chip in the display module is improved.

Description

technical field [0001] The present invention relates to the technical field of display equipment, in particular, to a display module and a display device including the display module. Background technique [0002] The requirements for the screen of the current mobile phone are increasing day by day, and the requirements for the D-IC will also be increased correspondingly when the screen is improved; this brings a series of new problems such as power consumption and heat dissipation, how to effectively use the D-IC Rapid heat dissipation is related to the performance and life of D-IC. At present, the OLED module D-IC is generally installed on the panel, and will be bent to the back of the module along with the panel, and then fixed on the SCF heat dissipation film with the bent gasket. At this time, the panel is separated between the D-IC and the SCF heat dissipation film. And curved gaskets, currently commonly used curved gaskets are made of PET or other plastic substrates ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30H05K7/20H01L27/32G09F9/35G09F9/37
CPCG09F9/301H05K7/20954G09F9/35G09F9/372H10K59/10
Inventor 刘伟杨皓天魏向东罗淼王康郝晓东朴劲宇沈家铭
Owner BOE TECH GRP CO LTD