Packaging structure and forming method thereof

A technology of packaging structure and molding method, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of complex and cumbersome processes and high process requirements, simplify the packaging process, improve mass production efficiency and quantity produce a stabilizing effect
CN113140469APending Publication Date: 2021-07-20JCET GROUP CO LTD
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
JCET GROUP CO LTD
Publication Date
2021-07-20

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Abstract

The invention relates to a packaging structure and a forming method thereof. The forming method comprises the following steps that at least two connecting parts are formed at a packaging module; an integrated external connection frame structure is carried on the packaging module, at least two external connection parts of the external connection frame structure are connected with the at least two connection parts respectively, and a connection beam between the adjacent external connection parts protrudes out of the external connection parts towards one side far away from the packaging module; a plastic packaging layer for packaging the outer connecting part is formed; and the outer connecting frame structure and the plastic packaging layer are thinned, so that the connecting beams and the outer connecting parts are disconnected, and the outer connecting parts are exposed out of the plastic packaging layer. Through the arrangement, the problems of high process requirements, complex process and the like caused by the fact that the connecting part in the packaging module is exposed out of the surface of the plastic packaging layer in an existing packaging structure can be solved.
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Description

technical field

[0001] The invention relates to the field of packaging technology, in particular to a packaging structure and a molding method thereof. Background technique

[0002] In packages such as POP packages and SIP packages, the packaged module usually needs to be electrically connected or thermally connected to other external modules. After the plastic sealing layer is formed on the packaging module, the plastic sealing layer needs to be processed again, so as to expose the connection part for external connection in the packaging module to the surface of the plastic sealing layer. Wherein, the packaging module may include a substrate or a chip component or a combination of both, and the connection portion may be a pad embedded in the substrate, a heat dissipation portion or an electrical connection portion on the chip component, and the like.

[0003] At present, there are usually two processing methods in the industry to expose the electrical connection part of th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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