Packaging structure and forming method thereof

A technology of packaging structure and molding method, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of complex and cumbersome processes and high process requirements, simplify the packaging process, improve mass production efficiency and quantity produce a stabilizing effect

Pending Publication Date: 2021-07-20
JCET GROUP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a package structure and its molding method to solve the problems of high process requirements and complicated processes caused by exposing the connection part of the package module to the surface of the plastic seal layer in the current package structure.

Method used

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  • Packaging structure and forming method thereof
  • Packaging structure and forming method thereof
  • Packaging structure and forming method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0082] Such as Figure 11 As shown, in this packaging structure, the packaging module 3 is composed of a substrate 31 and a chip component 33, the chip component 33 is connected to the substrate 31 through solder balls, the substrate 31 is embedded with a pad, and the back of the chip component 33 is provided with heat sink.

[0083] The outer connecting frame structure 5 can be made of a metal structure through an integral molding process. The formed integrated outer connecting frame structure 5 includes a connecting beam 52 and metal pins extending vertically downward from both ends of the connecting beam 52. The metal pins can be Formed by bending the edge of the metal structure, it plays the role of supporting the connecting beam 52; the upper surface of the metal structure can be punched to form the connecting beam 52, so that the middle part of the connecting beam 52 is depressed downward to form a depression, and the connecting beam 52 The two ends protrude and arch up...

Embodiment 2

[0089] Such as Figure 12 As shown, similarly, in this package structure, the package module 3 is composed of a substrate 31 and a chip component 33 , the substrate 31 is embedded with pads, and the back of the chip component 33 is provided with a heat sink.

[0090] Different from the first embodiment, in this embodiment, an electrical connection portion is provided on the back of the chip component 33 , and the electrical connection portion and the heat dissipation portion are independent of each other. The electrical connection part is used as the third connection part 333 .

[0091]Correspondingly, the middle part of the connecting beam 52 of the outer connecting frame structure 5 is also recessed downward to form another concave part, so that all the concave parts and the connecting beams 52 between all the metal pins protrude and arch upward. The lower end of the concave portion is used as the third outer connecting portion 533 .

[0092] Similarly, glue is firstly dis...

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PUM

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Abstract

The invention relates to a packaging structure and a forming method thereof. The forming method comprises the following steps that at least two connecting parts are formed at a packaging module; an integrated external connection frame structure is carried on the packaging module, at least two external connection parts of the external connection frame structure are connected with the at least two connection parts respectively, and a connection beam between the adjacent external connection parts protrudes out of the external connection parts towards one side far away from the packaging module; a plastic packaging layer for packaging the outer connecting part is formed; and the outer connecting frame structure and the plastic packaging layer are thinned, so that the connecting beams and the outer connecting parts are disconnected, and the outer connecting parts are exposed out of the plastic packaging layer. Through the arrangement, the problems of high process requirements, complex process and the like caused by the fact that the connecting part in the packaging module is exposed out of the surface of the plastic packaging layer in an existing packaging structure can be solved.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging structure and a molding method thereof. Background technique [0002] In packages such as POP packages and SIP packages, the packaged module usually needs to be electrically connected or thermally connected to other external modules. After the plastic sealing layer is formed on the packaging module, the plastic sealing layer needs to be processed again, so as to expose the connection part for external connection in the packaging module to the surface of the plastic sealing layer. Wherein, the packaging module may include a substrate or a chip component or a combination of both, and the connection portion may be a pad embedded in the substrate, a heat dissipation portion or an electrical connection portion on the chip component, and the like. [0003] At present, there are usually two processing methods in the industry to expose the electrical connection part of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/56H01L23/31
CPCH01L21/50H01L21/56H01L23/3107
Inventor 史海涛林耀剑周莎莎何晨烨陈建陈雪晴
Owner JCET GROUP CO LTD
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