Method for processing brittle materials
A hard material, processing brittle technology, applied in metal processing equipment, manufacturing tools, glass manufacturing equipment, etc., can solve problems such as slowness and not spatial resolution
Inactive Publication Date: 2021-07-23
SCHOTT AG
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Problems solved by technology
However, this requires the use of aggressive etching media, is also slow, and without other precautions such as masks, is not spatially resolved
Method used
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[0027] figure 1 The construction of workpiece 1 for separating and processing brittle hard materials, particularly made of glass or glass ceramics is shown. In particular, the edge 13 of the workpiece 1 can be used to form a chamfer at the edge 13. For processing, the surface of the workpiece 1 is irradiated with the laser beam 3, wherein the wavelength of the laser beam 3 is selected such that the light is absorbed at the surface 5 of the workpiece 1. As a result, the workpiece 1 is heated at surface 5, and a temperature gradient is formed in a direction from the surface 5 of the workpiece 1 to the interior. In order to produce a strong temperature gradient at the surface, it is advantageous that light is also absorbed directly at the surface of the workpiece. Generally, it is not limited to the exemplary embodiment shown, preferably the laser beam has a wavelength of at least 4.5 μm.
[0028] In order to generate sufficient local heating energy, the laser 30 is particularly pre...
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Abstract
The present invention provides a method for the separative processing of brittle-hard materials. The method includes the steps of: irradiating a surface of a workpiece (1) made of brittle-hard material with a laser beam (3) having a wavelength sufficient so that light of the laser beam (3) is absorbed at the surface and so that the workpiece (1) is heated to create a first temperature gradient in a direction from the surface to an interior of the workpiece (1); guiding the laser beam (3) over the surface (5) along an irradiated region; forming a second temperature gradient along the surface (5) between the irradiated region (7) and a non-irradiated region (9) adjacent the irradiated region (7), the first and second temperature gradients interacting in such a way that, on account of thermomechanical stresses, the workpiece (1) is separated below the surface (5) with a portion (11) of the workpiece (1) being severed in the form of a chip.
Description
Technical field [0001] The present invention generally relates to the processing of products made of brittle hard materials such as glass or glass ceramics. In particular, the present invention relates to separation and processing of brittle hard materials by removing materials. Background technique [0002] US 2018 / 0141154 A1 describes a method and apparatus for chamfering on the edge of the workpiece. Here, the laser beam is tilted to the edge of the workpiece to be processed to generate a tilted laser filament to generate a sloped laser filament in the edge. The laser is irradiated into the workpiece through a transparent element having an inclined surface to increase the incident angle on the workpiece. [0003] Another method of chamfering by laser processing from US 2010 / 0147813 A1 is known from US 2010 / 0147813 A1. The method produces a tilted groove extending in the glass by ablation by ablation by ablation by ablation by laser. However, when a larger cutting depth is to b...
Claims
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IPC IPC(8): B23K26/38B23K26/14B23K26/70
CPCB23K26/14B23K26/38B23K26/702B23K26/073B23K26/402B23K26/0624B23K26/082B23K26/53B23K2103/52B23K2103/54C03B33/06C03B33/091C03B33/095C03C23/0025B23K26/40
Inventor B·汉兹格尔A·阿尔祖海里A·奥特纳A·科格鲍尔I·阿德里安
Owner SCHOTT AG