Piezoelectric sweating cooling method based on piezoelectric material
A sweat cooling, piezoelectric technology, applied in the field of heat transfer and flow, can solve the problem of uneven flow distribution, achieve the effect of reducing structural quality, excellent mechanical properties and machinability
Pending Publication Date: 2021-07-23
NORTHWESTERN POLYTECHNICAL UNIV
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is to provide a piezoelectric material-based piezoelectric sweating cooling method for the above-mentioned deficiencies in the prior art, so that the cooling liquid can get rid of the dependence on the flow structure, and solve the problem of loose and porous sweating cooling medium. Disadvantages of uneven flow distribution caused by overheating
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Embodiment Construction
[0025] The present invention discloses a piezoelectric sweating cooling plate, which is used as the inner wall of the rocket engine combustion chamber, and forms a coolant circulation channel with the outer wall of the rocket engine combustion chamber; One side is the inner side, and the side facing the coolant flow channel is the outer side.
[0026] Such as figure 1 with 2 As shown, it includes: a substrate 1, which is divided into a porous area and a non-porous area. The porous area on the substrate 1 is covered with truncated micro-cone holes 2, and each micro-cone hole 2 penetrates the substrate 1, and the micro-cone holes 2 The small diameter end of the tapered hole 2 is located at the inner side end.
[0027] Piezoelectric ceramic rings 3 are multiple, all in the shape of rings, spaced and flatly attached to the non-porous area on the base 1, and located on the outer wall surface; the two opposite wall surfaces of each piezoelectric ceramic ring 3 are respectively con...
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The invention discloses a piezoelectric sweating cooling plate, which comprises a substrate which is divided into a porous area and a non-porous area, the porous area on the substrate is fully distributed with circular-truncated-cone-shaped micro taper holes, all the micro taper holes penetrate through the substrate, and the small-diameter ends of the micro taper holes are located at the inner side face end; a plurality of piezoelectric ceramic rings, which are annular, are flatly attached to the non-porous area on the substrate at intervals, and are positioned on the wall surface of the outer side surface; and two opposite wall surfaces of each piezoelectric ceramic ring are respectively connected with a positive electrode and a negative electrode of an alternating current power supply. The piezoelectric ceramic rings are used for generating periodic mechanical vibration when the alternating current power supply is switched on to drive the substrate to perform periodic deformation vibration, so that each micro taper hole is deformed. The micro taper holes are used for extruding cooling liquid into a combustion chamber in the deformation process. By using the piezoelectric sweating cooling plate of the invention, the cooling liquid gets rid of dependence on a flowing structure, and the defect that flow distribution is uneven due to overheating of a loose porous sweating cooling medium is overcome.
Description
technical field [0001] The invention belongs to the technical field of heat transfer and flow, and in particular relates to a piezoelectric sweat cooling method based on piezoelectric materials. Background technique [0002] Sweating cooling technology can be regarded as a bionic technology. When the cooled surface is in a high temperature environment, the temperature of the heated surface is reduced by "sweating", thereby achieving the purpose of thermal protection. During the sweating cooling process, the cooling fluid flows from the pressure chamber through the porous wall through the external pump pressure, penetrates into the main flow, and forms a continuous film structure on the protected wall, weakening the heat transfer from the high temperature main flow to the wall. According to the heat transfer structure, sweat cooling can be divided into porous sweat cooling and laminate sweat cooling. The porous sweating cooling structure is simple, but when the heating surfa...
Claims
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Login to View More IPC IPC(8): F02K9/34F02K9/40F02K9/64
CPCF02K9/34F02K9/40F02K9/64
Inventor 李文强薛兆瑞秦飞何国强魏祥庚
Owner NORTHWESTERN POLYTECHNICAL UNIV