Composite circuit board for realizing vacuum sealing, and vacuum low-light-level imaging device

Abstract

The invention relates to a composite circuit board for realizing vacuum sealing, and a vacuum low-light-level imaging device. The composite circuit board comprises a ceramic substrate layer, a polyimide layer and an FR4 substrate layer, the ceramic substrate is located on the inner layer of the vacuum side, and the polyimide layer is located between the ceramic substrate layer and the FR4 substrate layer; and the ceramic substrate layer, the polyimide layer and the FR4 substrate layer are all provided with via holes for realizing electric connection between the ceramic substrate layer and the FR4 substrate layer, and the via holes are realized through blind buried holes and are filled with copper paste. The vacuum low-light-level imaging device comprises an input window, a tube shell and a base seat. The base seat comprises an image sensor located in a vacuum cavity and the composite circuit board used for achieving vacuum sealing. The ceramic substrate layer is used for welding an image sensor; and the lower end of the base seat is provided with pins as many as the pins of the image sensor. The composite circuit board and the vacuum low-light imaging device solve the problems of high temperature resistance and sealing in vacuum sealing, and can be used for realizing vacuum sealing of the low-light imaging device.

Description

technical field [0001] The invention belongs to the field of vacuum imaging devices, and in particular relates to a composite circuit board for realizing vacuum sealing and a vacuum low-light imaging device. Background technique [0002] For vacuum imaging devices, most of the processes currently used are to weld the tube shell and output window first, then put them into a vacuum exhaust table for high-temperature baking and degassing, and then seal the input window with indium. [0003] With the development of imaging digitalization, a vacuum imaging device that seals the image sensor in the vacuum cavity to replace the output window has begun to appear. Gas, and the image sensor is an electronic component that cannot withstand high temperature for a long time, so it is necessary to improve the sealing process to achieve vacuum sealing. [0004] In addition, the vacuum imaging device usually uses a ceramic adapter board as the base, and the image sensor usually requires hu...

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Problems solved by technology

[0010] The general purpose of the present invention is to provide a composite circuit board and a vacuum low-light imaging device for realizing vacuum sealing, aiming at solving the problem that the image sensor cannot withstand high temperature and the ceramic adapter plate is easy to use as a base in the existing vacuum sealing process. Problems such as air leakage and traditional PCB cannot be used to achieve vacuum sealing

[0011] Specifically, one of the purposes of the present invention is to provide a composite circuit board for vacuum sealing, which can solve the disadvantage that traditional boards cannot be used as vacuum components, and at the same time solve the problem that traditional vacuum components cannot carry image sensors and cannot be used as circuit boards. Insufficient board

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