Unlock instant, AI-driven research and patent intelligence for your innovation.

Taiko ring removal method and positioning device for removing Taiko ring

A positioning device and Taiko technology, applied in the direction of fine working devices, stone processing equipment, laser welding equipment, etc., can solve the problems of wafer breakage and inaccurate positioning, and achieve the effect of reducing the risk of damage and accurate positioning

Pending Publication Date: 2021-07-27
HUA HONG SEMICON WUXI LTD
View PDF13 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then in the follow-up process step, the Taiko ring needs to be removed. In the prior art, multiple methods for removing the Taiko ring are disclosed to prevent the wafer from being broken when cutting the Taiko ring.
However, the existing technology only pays attention to the problem of wafer breakage during dicing and removal, and does not pay attention to the problem of damage during the positioning process of the wafer before dicing, and the technical problem of inaccurate positioning when the dicing film is attached.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Taiko ring removal method and positioning device for removing Taiko ring
  • Taiko ring removal method and positioning device for removing Taiko ring
  • Taiko ring removal method and positioning device for removing Taiko ring

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1 is Taiko ring removal method

[0030] figure 1 It is a schematic diagram of the steps of the Taiko ring removal method of the present embodiment

[0031] In step S1, the wafer 1 is processed and thinned by the Taiko process, and the middle part of the wafer 1 is thinned to a preset thickness, and the edge part of the wafer 1 is not thinned to form a Taiko ring 2 .

[0032] Step S2, sticking the dicing film 3 on the non-thinning surface of the wafer 1, and fixing the wafer 1 to the frame 4, as figure 2 shown.

[0033] The diameter of the dicing film 3 is larger than that of the wafer 1 . The cut film 3 is in surface contact with the frame 4 .

[0034] Frame 4 is usually made of stainless steel, and its shape can be as figure 1 As shown, the periphery is slightly larger than the dicing film 3 , which can be used as a fixing part for cutting the taiko ring 2 , and can also be packaged with the wafer 1 later as a structural member for protecting the wafer...

Embodiment 2

[0048] Example 2 is a positioning device for Taiko ring removal

[0049] The positioning device includes a camera, a control unit, and a mobile unit. The camera is used to take pictures of designated positions of the wafer, such as taking pictures of the edge of the wafer. In this embodiment, 4 cameras are provided to take pictures of 4 wafer edges at the same time. Four cameras are only one implementation mode, and three cameras can also be used to realize positioning. Of course, more cameras, for example, six cameras can be used to achieve higher positioning accuracy.

[0050] The control unit is used to obtain photo information, calculate the positioning deviation of the wafer, and control the movement of the mobile unit. After the control unit obtains the photo information, it calculates the center position A of the current wafer through the analysis and calculation of the edge position in the photo, and then calculates the deviation from the preset center position B requ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a Taiko ring removal method. The method comprises the following steps that a wafer is machined and thinned by the aid of a Taiko process, the middle of the wafer is thinned to a preset thickness, and a Taiko ring is formed at the edge part of the wafer; S2, the wafer is fixed to a frame; S3, the frame is placed on a cutting equipment tray, and the wafer is positioned by the aid of a positioning device. The invention further discloses the positioning device for removing the Taiko ring.

Description

technical field [0001] The invention relates to a method for manufacturing a semiconductor integrated circuit, in particular to a method for removing a Taiko ring and a positioning device thereof. Background technique [0002] With the development of semiconductor integrated circuit technology, wafers are getting thinner and thinner. In addition to effectively reducing the volume of subsequent packaging materials, thinning wafers can also reduce on-resistance, thereby reducing the cumulative effect of heat energy, and increasing the service life of chips. However, how to reduce the thickness of the wafer in the thinning process while taking into account the strength of the wafer and reduce the breakage rate is one of the technical focuses of the wafer processing technology research. [0003] Japan's Disco company has developed a Taiko thinning process, which is different from the previous back grinding. When grinding the wafer, it will keep the outer edge of the wafer (about...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B23K26/36B23K26/402B23K26/70
CPCB28D5/00B28D5/0058B28D5/0064B28D5/0082B23K26/36B23K26/402B23K26/70
Inventor 蔡永慧谭秀文苏亚青
Owner HUA HONG SEMICON WUXI LTD