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Ultrasonic tin plating device and tin plating method

A tinning device and ultrasonic technology, applied in hot-dip plating process, coating, metal material coating process, etc., can solve the problems of environmental protection, environmental protection restrictions, pollution and other problems in the large-scale use of flux, and meet the requirements of large-scale production Demand, the effect of solving environmental problems

Pending Publication Date: 2021-07-30
常州井芯半导体设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although electroplating technology can achieve tinning of terminals, it faces serious pollution problems and is increasingly restricted by environmental protection
[0003] An alternative technology is hot-dip plating technology, but this technology needs to be immersed in flux to remove the oxide film of the terminal, and then can be immersed in tin solution for tin plating, and there are environmental problems in the large use of flux

Method used

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  • Ultrasonic tin plating device and tin plating method
  • Ultrasonic tin plating device and tin plating method
  • Ultrasonic tin plating device and tin plating method

Examples

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Embodiment

[0033] Please refer to figure 1 , the present embodiment provides an ultrasonic tinning device, including: a closed tin tank 1, an ultrasonic vibration device 4 and a tin pump 3; the closed tin tank 1 includes a cavity and an openable door 6, and the cavity has a first Chamber 11, second chamber 12, an opening is provided above the second chamber 12, an openable door 6 is arranged on the opening and can open or close the opening, the first chamber 11 communicates with the second chamber 12, and the tin pump 3 is used to pump tin liquid from the first chamber 11 to the second chamber 12, and the ultrasonic vibration device 4 is arranged in the cavity and used to transmit ultrasonic energy to the tin liquid in the second chamber 12.

[0034] Wherein, it may be selected that the length and width of the ultrasonic tinning area of ​​the ultrasonic vibration device 4 are greater than 50 mm×50 mm. In this embodiment, the length and width of the ultrasonic tinning area of ​​the ultra...

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Abstract

The invention provides an ultrasonic tin plating device and a tin plating method, and relates to the technical field of electronic manufacturing. The ultrasonic tin plating device comprises a closed tin bath, an ultrasonic vibration device and a tin pump. The closed tin bath comprises a cavity and a door capable of being opened and closed, a first cavity and a second cavity are formed in the cavity, an opening is formed in the upper portion of the second cavity, the door capable of being opened and closed is arranged at the opening, the first cavity communicates with the second cavity, the tin pump is used for pumping tin liquid from the first cavity to the second cavity, and the ultrasonic vibration device is arranged in the cavity. The tin plating method comprises the steps that the tin pump pumps tin liquid in the first cavity to the second cavity, and an ultrasonic vibration device is submerged by the tin liquid; the door capable of being opened and closed is opened, a terminal is put and is put into the tin liquid; and the ultrasonic vibration device works. Due to the fact that the ultrasonic vibration device is arranged, under the condition that scaling powder is not needed, the ultrasonic tin plating device and the tin plating method can remove an oxidation film on the surface of the terminal, and the environmental protection problem caused by a conventional electroplating technology is solved.

Description

technical field [0001] The invention relates to the technical field of electronic manufacturing, in particular to an ultrasonic tinning device and a tinning method. Background technique [0002] The terminals of components need to be tinned to form a tin coating. Although electroplating technology can achieve tinning of terminals, it faces serious pollution problems and is increasingly restricted by environmental protection. [0003] An alternative technology is the hot-dip plating technology, but this technology requires immersion in flux to remove the oxide film of the terminal before immersion in tin solution for tin plating, and the extensive use of flux has environmental problems. Contents of the invention [0004] The object of the present invention is to provide an ultrasonic tinning device, which can improve the environmental protection problems caused by the existing tinning technology. [0005] Another object of the present invention is to provide a tinning met...

Claims

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Application Information

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IPC IPC(8): C23C2/08C23C2/22
CPCC23C2/08C23C2/003C23C2/22Y02P10/20
Inventor 张曹
Owner 常州井芯半导体设备有限公司
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