Test fixture for IGBT&KGD chip

Abstract

The invention discloses a test fixture for an IGBT&KGD chip. The test fixture has the IGBT KGD chip testing effect, a screwing cover plate is arranged on a testing box, a heating rod and a temperature induction galvanic couple are arranged in the testing box, the heating rod is sleeved with an insulation protection sleeve, the insulation protection sleeve is made of an aluminum nitride material, the insulation protection sleeve is installed on a testing box bottom plate, and an adjusting gasket is arranged in the testing box body. The adjusting washer is arranged in an adjusting washer mounting plate, a plastic insulating block is arranged below the adjusting washer mounting plate, the testing box bottom plate is arranged below the plastic insulating block, an upper copper block is arranged on the lower surface of the testing box bottom plate, an upper copper block probe is arranged in the upper copper block, the buckles are arranged at the two ends of the testing box body, and the buckle springs are arranged between the buckles and the testing box body. The lower end of the testing box is provided with a measuring base, a lower copper block probe group is arranged in the measuring base, two sides of the measuring base are provided with a gas inlet and a gas outlet, inlet and outlet gas is nitrogen, and the lower surface of the testing box bottom plate is provided with a shunt probe group.

Description

technical field [0001] The invention relates to the technical field of chip test fixtures, in particular to a test fixture for IGBT&KGD chips. Background technique [0002] IGBT is an insulated gate bipolar transistor, which is a composite fully-controlled voltage-driven power semiconductor device composed of BJT (bipolar transistor) and MOS (insulated gate field effect transistor), and has a MOSFET (field effect transistor) With the advantages of high input impedance and low conduction voltage drop of GTR (giant transistor), the KGD chip is a known qualified chip, the full name is Knowngood die, and the Chinese translation is: known good chip. When the operator completes the production and the production yield is above 90%, the remaining 10% who pass the test are KGD. [0003] IGBT is the core device of energy conversion and transmission, commonly known as the "CPU" of power electronic devices. The IGBT chip is an insulated gate bipolar transistor, which has the advantages...

AI Technical Summary

Problems solved by technology

[0004] The unpackaged IGBT&KGD chip is ultra-thin (thickness 75~150UM), and the test requires a large current (400A and above for 2ms, 1000A and above for 90ns instantaneous current), a large voltage (600V and above), manual testing is required before mass production, and the part of the chip is simply verified Electrical performance, and a large number of processes require manual testing, but the danger of manual testing can be imagined, whether it is the false contact of high voltage or the instability in the testing process, it will bring a lot to the tester. Injuries can range from injury to loss of life, and being in the environment of the test room for a long time will have an impact on the health of the testers

There are also endless methods for chip testing, but they are too targeted. Each method is only applicable to the corresponding chip test.

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