A test fixture for igbt&kgd chips

Abstract

The invention discloses a test fixture for an IGBT&KGD chip. The present invention has the effect of IGBT&KGD chip testing. The screwed cover is set on the test box. The test box is equipped with a heating rod and a temperature sensing couple. The heating rod is covered with an insulating protective sleeve, which is made of aluminum nitride material. The insulating protective cover is installed on the bottom plate of the test box. An adjustment washer is arranged in the test box. There is an upper copper block on the lower surface of the bottom plate of the box, and an upper copper block probe is arranged inside the upper copper block. Buckles are arranged at both ends of the test box, and a snap spring is set between the buckle and the test box. The lower end of the test box is provided with The measuring machine base is equipped with a lower copper block probe set in the measuring machine base, and the two sides of the measuring machine base are provided with an air inlet and an air outlet.

Description

technical field [0001] The invention relates to the technical field of chip test fixtures, in particular to a test fixture for IGBT&KGD chips. Background technique [0002] IGBT is an insulated gate bipolar transistor, which is a composite fully-controlled voltage-driven power semiconductor device composed of BJT (bipolar transistor) and MOS (insulated gate field effect transistor), and has a MOSFET (field effect transistor) With the advantages of high input impedance and low conduction voltage drop of GTR (giant transistor), the KGD chip is a known qualified chip, the full name is Knowngood die, and the Chinese translation is: known good chip. When the operator completes the production and the production yield is above 90%, the remaining 10% who pass the test are KGD. [0003] IGBT is the core device of energy conversion and transmission, commonly known as the "CPU" of power electronic devices. The IGBT chip is an insulated gate bipolar transistor, which has the advantages...

AI Technical Summary

Problems solved by technology

[0004] The unpackaged IGBT&KGD chip is ultra-thin (thickness 75~150UM), and the test requires a large current (400A and above for 2ms, 1000A and above for 90ns instantaneous current), a large voltage (600V and above), manual testing is required before mass production, and the part of the chip is simply verified Electrical performance, and a large number of processes require manual testing, but the danger of manual testing can be imagined, whether it is the false contact of high voltage or the instability in the testing process, it will bring a lot to the tester. Injuries can range from injury to loss of life, and being in the environment of the test room for a long time will have an impact on the health of the testers

There are also endless methods for chip testing, but they are too targeted. Each method is only applicable to the corresponding chip test.

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