Method and device for cleaning micro-nano particles by time-controlled double-beam laser induced shock waves

Abstract

A method for cleaning micro-nano particles by time-controlled double-beam laser induced shock waves comprises the steps that a to-be-cleaned substrate is placed on a three-dimensional moving platform, and the three-dimensional moving platform is moved so that the surface of the to-be-cleaned substrate can be located below a laser focusing point; double-beam laser beams are focused in gas above the surface of the to-be-cleaned substrate through two focusing mirrors to induce gas breakdown; the double-beam laser beams are generated by two lasers, the delay time between the double-beam laser beams is regulated and controlled by a digital delay generator, and the time interval between the two laser beams is 0-100 microseconds; plasma shock waves are generated, and micro-nano particle pollutants on the to-be-cleaned substrate are erased under the action of shock wave force and fly away from the surface of the to-be-cleaned substrate. The invention further provides a device for cleaning the micro-nano particles by the time-controlled double-beam laser induced shock waves. According to the method, residual particles under shock waves can be effectively removed while the advantages of a traditional laser-induced plasma cleaning technology are reserved, and the cleaning efficiency is improved.

Description

technical field [0001] The invention relates to surface cleaning technology, in particular to a method for cleaning micro-nano particles by time-regulated double-beam laser-induced shock waves. Background technique [0002] Particle pollution will reduce the performance of integrated circuits, micro-machines, precision optical components and other products, and in severe cases will lead to product scrapping. Traditional mechanical cleaning and chemical cleaning methods, such as mechanical scrubbing, chemical solution immersion, and ultrasonic cleaning, have the problems of destroying the substrate and secondary pollution, and these methods have low cleaning efficiency for particles with a diameter of less than 100nm. [0003] Laser-induced plasma cleaning is to focus in a gas atmosphere, induce gas ionization to generate plasma shock waves, and use the force of the waves to remove nanoparticles on the contaminated surface. This technology avoids the direct interaction betwe...

AI Technical Summary

Problems solved by technology

This technology avoids the direct interaction between the laser and the substrate, can effectively remove nano-sized particles, is easy to control, has high efficiency, and has no damage to the substrate. Residual uncleaned area, which not only reduces the efficiency of shock wave cleaning but also restricts its application

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