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A kind of LED package structure and LED light source device

A technology of LED packaging and reflective cups, which is applied to semiconductor devices of light-emitting elements, light sources, and light source fixing, etc., can solve the problems of increased difficulty in LED lamp operation, achieve the effects of reduced friction area, firm fit, and elimination of internal stress

Active Publication Date: 2021-10-08
佛山市其利照明电器有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The package structure mainly focuses on the form and category of the package, the material of the substrate, the shell, and the leads, emphasizing its important role in protecting the chip, enhancing the electrothermal performance, and facilitating the assembly of the whole machine. However, most of the existing LED package structures are in pursuit of higher sealing. Performance, the outer structure such as the bottom plate, the shell and the lampshade are sealed by integral molding, welding or sealant. Although the sealing performance of the LED lamp is improved, the operation difficulty will increase when the LED lamp needs to replace parts; moreover, large Most LED lamps still have defects in adjusting the direction of light irradiation internally; therefore, it is necessary to design an LED packaging structure and LED light source device

Method used

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  • A kind of LED package structure and LED light source device
  • A kind of LED package structure and LED light source device
  • A kind of LED package structure and LED light source device

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Embodiment Construction

[0030] Such as Figure 1~8 As shown, the present invention provides an LED packaging structure, which includes a base 1, a limiting side 2 is provided on the edge of the surface of the base 1, and a housing 3 is provided on the surface of the base 1 inside the limiting side 2. The inner side of the bottom end of the shell 3 is provided with a first matching groove, the edge of the first matching groove is provided with a first expansion rubber ring 4, and the surface of the base 1 inside the first expansion rubber ring 4 is provided with a heat dissipation substrate 5 , the inner wall of the top of the housing 3 is provided with a second matching groove, the bottom end of the second matching groove is fitted with a gasket block 6, a lampshade 7 is arranged above the gasket block 6, and the gasket block 6 The inner side is provided with an annular third matching groove, and a rotating fixed seat 8 is fitted in the third matching groove, and a rotation control mechanism is arran...

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Abstract

The invention discloses an LED packaging structure, which comprises a base, a shell is arranged on the surface of the base inside the limiting edge, a heat dissipation substrate is arranged on the surface of the base inside a first expansion rubber ring, a lampshade is arranged above the gasket block, and a third A rotating fixing seat is fitted in the matching groove, a rotating control mechanism is arranged on the rotating fixing seat and one side wall of the casing, a reflector is matched in the fourth matching groove, and an LED chip mounting plate is arranged on the reflector at the bottom of the groove. A combined lens is arranged on the reflective cup above the LED chip mounting plate, an angle adjustment mechanism is arranged on the bottom end of the reflective cup and one side wall of the casing, and an anti-glare net is arranged on the top surface of the lampshade. The invention provides a middle base , The installation and fixation effect between the shell, the lampshade and the anti-glare net is better, and the LED packaging structure can adjust the light irradiation angle through the rotation control mechanism and the angle adjustment mechanism, and the invention also provides a sealing and light irradiation effect. LED light source device.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to an LED packaging structure and an LED light source device. Background technique [0002] The package structure mainly focuses on the form and category of the package, the material of the substrate, the shell, and the leads, emphasizing its important role in protecting the chip, enhancing the electrothermal performance, and facilitating the assembly of the whole machine. However, most of the existing LED package structures are in pursuit of higher sealing. Performance, the outer structure such as the bottom plate, the shell and the lampshade are sealed by integral molding, welding or sealant. Although the sealing performance of the LED lamp is improved, the operation difficulty will increase when the LED lamp needs to replace parts; moreover, large Most LED lamps still have defects in the aspect of internally adjusting the direction of light irradiation; therefore, it is necessa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K9/20F21V5/04F21V15/00F21V17/16F21V31/00F21Y115/10
CPCF21V5/04F21V15/00F21V17/16F21V31/005F21K9/20F21Y2115/10
Inventor 魏俊敏
Owner 佛山市其利照明电器有限公司
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