Supercharge Your Innovation With Domain-Expert AI Agents!

Display panel and display device

A technology for display panels and substrates, used in identification devices, instruments, electrical components, etc., can solve problems such as insufficient heat dissipation, decrease in chip luminous efficiency, phosphor lasing efficiency, and asymmetrical distribution of thermal stress. The effect of large heat dissipation area and accelerated heat dissipation efficiency

Active Publication Date: 2021-08-06
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] During the research and practice of the prior art, the inventor of the present application found that, for a light emitting diode (Light Emitting Diode, LED) chip, if the heat dissipation Insufficient, will cause non-uniform distribution of thermal stress, chip luminous efficiency and phosphor laser efficiency decline

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Display panel and display device
  • Display panel and display device
  • Display panel and display device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The technical solutions in this application will be clearly and completely described below in conjunction with the drawings in this application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application. In addition, it should be understood that the specific implementations described here are only used to illustrate and explain the present application, and are not intended to limit the present application. In this application, unless stated to the contrary, the used orientation words such as "up" and "down" usually refer to up and down in the actual use or working state of the device, specifically the direction of the drawing in the drawings ; while "inside" and "outside" refer to the outline of the device.

[0030] The application...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Depthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a display panel and a display device. The display panel comprises an array substrate, a heat dissipation structure layer, a binding substrate and an adhesive layer. According to the display panel provided by the invention, the heat dissipation structure layer is added between the array substrate and the binding substrate. The heat dissipation structure layer absorbs and dissipates heat released by the array substrate so as to prevent devices in the display panel from losing efficacy due to heating. Moreover, heat dissipation grooves are formed in the heat dissipation structure layer, on one hand, the heat dissipation grooves can increase the heat dissipation area and improve the heat dissipation efficiency, and on the other hand, the heat dissipation grooves can serve as flow guide plates to dissipate heat out of the display panel in a hot air flow mode.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display panel and a display device thereof. Background technique [0002] During the research and practice of the prior art, the inventors of the present application found that, for light-emitting diode (Light Emitting Diode, LED) chips, if the heat dissipation is not sufficient, it will cause non-uniform distribution of thermal stress and reduce the luminous efficiency of the chip. And phosphor lasing efficiency drops. Studies have shown that when the temperature exceeds a certain value, the failure rate of the device will climb exponentially. [0003] Therefore, it is particularly important to dissipate heat from the LED chip to avoid device failure. Contents of the invention [0004] The present application provides a display panel and a display device, which can dissipate heat from the display panel and avoid device failure caused by heat. [0005] The appli...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/367H01L23/373H01L27/12G09F9/33
CPCH01L23/367H01L23/3735H01L27/1214G09F9/33
Inventor 史金明
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More