Substrate treatment apparatus
A substrate processing and equipment technology, applied in the field of substrate processing equipment, can solve problems such as difficulty in ensuring the uniformity of processing technology
Pending Publication Date: 2021-08-06
JUSUNG ENG
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Problems solved by technology
[0010] As described above, the substrate processing apparatus 10 of the related art has a problem that it is difficult to ensure the uniformity of the processing process performed on the substrate 20
Method used
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Embodiment Construction
[0036] Hereinafter, an embodiment of a substrate processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0037] refer to Figure 2 to Figure 4 , a substrate processing apparatus 1 performs a processing process on a substrate S according to the present invention. For example, the substrate processing apparatus 1 according to the present invention may perform at least one of a deposition process for depositing a thin film on the substrate S and an etching process for removing a part of the deposited thin film on the substrate S. The substrate processing equipment 1 according to the present invention includes a support portion 2, a cover body 3, a purge gas injection unit 4, an injection means 5, and a partition wall means 6 (shown in Figure 4 ) and a shield 7 (shown in figure 2 ).
[0038] refer to figure 2 and image 3 , the support portion 2 supports the substrate S. The support part 2 may be c...
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The present invention relates to a substrate treatment apparatus comprising: a chamber in which a treatment process on a substrate is performed; a support unit coupled to the chamber and supporting the substrate; a cover coupled to the chamber so as to be disposed above the support unit; a purge gas injection unit which is coupled to the lead and injects a purge gas into a treatment space between the lead and the support unit in order to partition the treatment space into a plurality of treatment regions; a shield coupled to the cover so as to be disposed between the cover and the support unit; a first injection unit for injecting a first gas onto a first treatment region among the treatment regions; a second injection unit for injecting the first gas onto the first treatment region from a position spaced apart from the first injection unit; and a first partition wall unit which is coupled to the shield so that a first injection region disposed below the first injection unit, a second injection region disposed below the second injection unit, and a first partitioning space between the first injection region and the second injection region constitute the region in which the treatment process using the first gas is performed.
Description
technical field [0001] The present invention relates to a substrate processing apparatus which performs processing processes such as deposition process and etching process on a substrate. Background technique [0002] In general, in order to manufacture solar cells, semiconductor devices, flat panel display devices, etc., thin film layers, thin film circuit patterns or optical patterns should be formed on a substrate. To this end, a processing process is performed on the substrate, such as a deposition process that deposits a film containing a specific material on the substrate, a photo process that selectively exposes a portion of the film using a photosensitive material, removing this option Portions of the film are selectively exposed to form a pattern and so on. Such a processing process is performed on the substrate by the substrate processing equipment. [0003] figure 1 It is a schematic side sectional view of a related art substrate processing equipment. [0004]...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/68771H01L21/6719C23C16/45523C23C16/45519C23C16/45544H01L21/67034H01L21/67069H01L21/67207C23C16/4401
Inventor 吴东赫权秀泳金種植
Owner JUSUNG ENG