Suction cup group for sucking multiple wafers

Abstract

The invention relates to the technical field of photovoltaic and semiconductor manufacturing, in particular to a suction cup group for sucking multiple wafers, which can realize circulation of the multiple wafers at one time, prevent relative movement between the wafers and the contact surface of a suction cup in the circulation process, reduce damage to the surfaces of the wafers, improve the production efficiency of the wafers and the yield of the wafers in the circulation process. The suction cup group comprises at least two suction cups and a mounting base; the suction cups are arranged side by side at intervals; each suction cup comprises a mounting area and an adsorption area; a vacuum flow guide air channel is formed in the front face of each adsorption area; and a vacuumizing opening is formed in each vacuum flow guide air channel; the front surface of each mounting area is higher than that of the corresponding adsorption area; the front face of each mounting area is provided with a slicing air channel; the end of each mounting area is provided with a suction cup vacuum air inlet; each suction cup vacuum air inlet is communicated with the corresponding vacuumizing opening through a communication air channel in the corresponding suction cup; the mounting base comprises an air distribution plate, a suction cup fixing base and a sealing pressing plate which are fixedly connected; and a first sealing gasket is arranged between the air distribution plate and the suction cup fixing base.

Description

technical field [0001] The invention relates to the technical field of photovoltaic and semiconductor manufacturing, in particular to a suction cup group for picking up multiple wafers. Background technique [0002] With the continuous development of semiconductor technology, the application of semiconductors is becoming more and more extensive. In semiconductor production, wafers are products before chip processing and molding. During the processing and production of wafers, they need to be transported. The traditional circulation relies on suction cups one by one. The efficiency of wafer removal is very low. During the process of sucking the wafer by the chuck, the relative movement between the chuck and the wafer surface often occurs, causing damage to the wafer surface, which affects the yield rate during the wafer transfer process. Contents of the invention [0003] In order to solve the problem of low efficiency of existing wafer transfer and easy damage to the surfa...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of low efficiency of existing wafer transfer and easy damage to the surface of the wafer during the transfer process, the present invention provides a suction cup set for absorbing multiple wafers, which can realize the transfer of multiple wafers at one time, and the transfer process Prevent the relative movement of the contact surface between the wafer and the chuck, reduce damage to the wafer surface, and improve the production efficiency and yield of the wafer in the process of circulation

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