Sub-resolution graph adding method and device, equipment and medium

A sub-resolution, graphic technology, applied in optomechanical equipment, microlithography exposure equipment, photolithography process exposure devices, etc., can solve the problems of blind window through hole, large difference in optical environment, small process window, etc.

Pending Publication Date: 2021-08-31
GTA SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the large difference in the optical environment between the target hole pattern and the peripheral hole pattern in the prior art, the lithographic analysis ability of the target hole p...

Method used

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  • Sub-resolution graph adding method and device, equipment and medium
  • Sub-resolution graph adding method and device, equipment and medium
  • Sub-resolution graph adding method and device, equipment and medium

Examples

Experimental program
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Effect test

Embodiment 1

[0065] Such as figure 1 As shown, this embodiment provides a method for adding sub-resolution graphics, the adding method includes the following steps:

[0066] Step S1, intercepting multiple design layouts including weak point graphics from the original layout.

[0067] In this embodiment, the original layout can be a hole-level layout, which is added through multiple rounds of conventional sub-resolution graphics, that is, if there is a graphic spacing in the data layout that meets the addition rules, a sub-resolution of a preset size will be performed. Graphics are added until all graphic spaces are filled with sub-resolution graphics.

[0068] Obtain the weakness graphic library of the process window collected from the existing publication results that cannot meet the mass production requirements, compare the feature maps with the original layout, and screen out multiple design layouts with a small process window (window) that cannot meet the process output requirements ...

Embodiment 2

[0088] On the basis of Embodiment 1, this embodiment provides a method for adding sub-resolution graphics, such as Figure 9 As shown, the flow chart of this embodiment is shown. Compared with embodiment 1, the SRAF graphics also include line graphics, and the step S3 of the adding method also includes:

[0089] Step S33 , dividing the line-shaped figure into a first end area, a second end area, and an associated area.

[0090] Step S34 , determining the range of the second target area according to the area of ​​the first end area; wherein, the second target area partially overlaps with the first end area.

[0091] Step S35 , determining the range of the third target area according to the area of ​​the second end area; wherein, the third target area partially overlaps with the second end area.

[0092] Step S36 , segmenting the long side of the associated area to form a stepped ladder pattern.

[0093] Step S37 , based on the fact that the area corresponding to the stepped ...

Embodiment 3

[0099] This embodiment provides a system for adding sub-resolution graphics, such as Figure 13 As shown, it specifically includes: an acquisition module 20 , an addition module 30 , an adjustment module 40 , an overlay module 50 and an OPC processing module 60 ; the adjustment module 40 includes a first determination unit 41 and a first adjustment unit 42 .

[0100] Wherein, the acquisition module 20 is configured to intercept multiple design layouts including weak point graphics from the original layout.

[0101] In this embodiment, the original layout can be a hole-level layout, which is added through multiple rounds of conventional sub-resolution graphics, that is, if there is a graphic spacing in the data layout that meets the addition rules, a sub-resolution of a preset size will be performed. Graphics are added until all graphic spaces are filled with sub-resolution graphics.

[0102] Obtain the weakness graphic library of the process window collected from the existing p...

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PUM

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Abstract

The invention discloses a sub-resolution graph adding method and device, equipment and a medium. The adding method comprises the following steps of intercepting a plurality of design layouts containing weak-point graphs from an original layout, conducting model-assisted rule-based SRAF graph addition on a region allowing addition of a sub-resolution graph in each design layout, and adjusting the shape of the SRAF graph according to a simulation result of mass production. According to the method, a model-assisted rule-based SRAF adding mode is adopted for part of weak-point graphs of which the process windows cannot meet the mass production requirement, so that the optical environment of the target hole graph in the weak-point graphs can tend to be consistent with that of the surrounding hole graphs, the process windows are enlarged, and the production requirement is met.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method, device, equipment and medium for adding sub-resolution graphics. Background technique [0002] In the manufacturing process of integrated circuits of 28 nanometers and below, each foundry has been able to maturely apply OPC (Optical Proximity Correction, optical proximity correction) technology. Faced with the situation that the design size is getting smaller and the design layout is getting more and more complex, adding sub-resolution graphics to the design layout to improve the process has become the mainstream practice in the industry. [0003] The sub-resolution graphics are usually added in a multi-round cycle, that is, as long as there is a qualified design layout spacing, the sub-resolution graphics will be added until there is no suitable position in the design layout. This method of adding sub-resolution graphics is aimed at special layout ...

Claims

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Application Information

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IPC IPC(8): G03F7/20G03F1/36G06F30/392
CPCG03F7/70508G03F7/70441G03F1/36G06F30/392
Inventor 夏国帅杨红
Owner GTA SEMICON CO LTD
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