Integrated brazing heating disc
A heating plate and brazing technology, used in electric heating devices, welding equipment, metal processing equipment, etc., can solve the problems of low cooling efficiency, low processing efficiency, long time, etc., and achieve uniform heating effect, light weight and good thermal conductivity. Effect
Pending Publication Date: 2021-09-03
爱利彼半导体设备(中国)有限公司
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Problems solved by technology
[0003] In the process of semiconductor processing, a brazing process is also required. The existing brazing heating plate can only perform simple heating brazing. After the brazing is completed, the product is usually naturally cooled, and the cooling efficiency is low and the time is long, resulting The overall production process has low processing efficiency and takes a long time
Method used
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Embodiment
[0030] An integrated brazing heating plate, such as Figure 1 to Figure 3 As shown, it includes: a brazing chassis 1, the middle part of the brazing chassis 1 is provided with a connecting sleeve 2, the lower end of the connecting sleeve 2 is provided with a connecting head 21, and a plurality of locking screw holes 22 are provided on the connecting head 21 for brazing. The chassis 1 is made of aluminum alloy material, the connecting sleeve 2 is pierced with a cooling pipe 4 and a heating pipe, the cooling pipe 4 and the heating pipe are laid on the upper surface of the brazing chassis 1 in a spiral disk shape, and the cooling pipe 4 The heating pipes are arranged at intervals, the two ends of the cooling pipe 4 extend out of the connecting sleeve 2, the water inlet end of the cooling pipe 4 is provided with a first joint 41, the water outlet end of the cooling pipe 4 is provided with a second joint 42, and the brazing chassis 1 The upper surface is provided with a composite b...
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The invention relates to an integrated brazing heating disc. The integrated brazing heating disc comprises a brazing chassis, a connecting sleeve is arranged in the middle of the brazing chassis, a connector is arranged at the lower end of the connecting sleeve, a plurality of locking screw holes are formed in the connector, the brazing chassis is made of aluminum alloy materials, a cooling pipe and a heating pipe are arranged in the connecting sleeve in a penetrating mode, the cooling pipe and the heating pipe are both laid on the upper surface of the brazing chassis in a spiral disc shape and are arranged at intervals, the two ends of the cooling pipe extend out of the connecting sleeve, the water inlet end of the cooling pipe is provided with a first joint, the water outlet end of the cooling pipe is provided with a second joint, and a composite base plate is arranged on the upper surface of the brazing chassis. According to the integrated brazing heating disc, in the semiconductor product machining process, the heating disc and a product can be rapidly cooled through the cooling pipe, the product forming efficiency and the brazing quality are improved, the time interval of next brazing is shortened, and the product machining efficiency is improved.
Description
technical field [0001] The invention relates to the technical field of heating discs, in particular to an integrated brazing heating disc. Background technique [0002] Domestic appliances such as electric kettles and rice cookers use electric heating plates to generate heat, and transfer the heat to stainless steel or aluminum alloy containers through the aluminum alloy bottom plate, thereby achieving the purpose of heating water and food. However, the traditional brazing method of aluminum alloy electric heating plate is to braze and weld the aluminum alloy circular plate and the heating tube together. The brazing material in the middle is 4000 series powdered aluminum alloy solder, aluminum solder paste or 4000 series aluminum alloy The blank is protected by a protective gas such as ammonia decomposition gas or an inert gas, and under the action of flux, a metallurgical brazing connection is formed between the heating tube, the aluminum alloy disc and the stainless steel....
Claims
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IPC IPC(8): B23K3/053B23K3/08
CPCB23K3/053B23K3/085
Inventor 方明喜肖学才
Owner 爱利彼半导体设备(中国)有限公司