Heat-conducting gasket and preparation method thereof

A technology for thermally conductive gaskets and thermally conductive fillers, which is applied to chemical instruments and methods, flat products, heat exchange materials, etc., can solve the problems of increased application thermal resistance, change of orientation of thermally conductive fillers, large-scale, low degree of continuity, etc. Achieve the effects of improved thermal conductivity, reduced application thermal resistance, and excellent mechanical properties

Pending Publication Date: 2021-09-03
CHANGZHOU FUXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process steps are relatively complicated, and there are large gaps when stacking, which may easily cause voids in the pressed material
At the same time, due to the fusion of gaps and overflow during pressing, it is easy to cause changes in the orientation of thermally conductive fillers in the material
In addition, because compression molding is required after stacking and cutting into pieces in the vertical direction of extrusion, the scale and continuous degree of this method are low, and it is not only difficult to prepare large sheets of high thermal conductivity gaskets, but also the gasket The thickness, surface roughness, etc. are difficult to control, and it is easy to cause the problem of increasing the thermal resistance of the application

Method used

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  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof
  • Heat-conducting gasket and preparation method thereof

Examples

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preparation example Construction

[0039] An exemplary method for preparing a thermal pad of the present invention generally includes the following steps:

[0040] (1) After mixing the binder, the two-dimensional thermally conductive filler and other optional components, and optionally vacuum defoaming, a mixed material is obtained;

[0041] (2) extruding the mixed material into a sheet through a split-combination die head;

[0042] (3) The sheet is drawn, calendered and vulcanized to obtain the thermal pad.

[0043] As the binder of the present invention, it can be selected from at least one of thermosetting resins, thermoplastic resins, thermoplastic elastomers or mixtures thereof.

[0044] The thermosetting resin is selected from at least one crosslinking resin, such as epoxy resin, phenolic resin, silicone resin, polyurethane, polyimide resin, unsaturated polyester, polymethylsiloxane, maleamide At least one of resin, thermosetting polyphenylene ether, melamine formaldehyde resin, furfural phenol resin, fur...

Embodiment 1

[0104] In the present embodiment, each component that adopts is as follows:

[0105] Binder: two-component addition type liquid silicone;

[0106] Two-dimensional thermally conductive filler: graphite, with a sheet diameter of 50-150 μm and a thickness of 1-5 μm;

[0107] Isotropic thermally conductive filler: alumina, with an average particle size of 20 μm;

[0108] Catalyst: platinum catalyst;

[0109] The preparation and implementation process is as follows:

[0110] (1) The raw materials of each component are uniformly mixed according to the following mass parts ratio:

[0111] Two-component addition type liquid silica gel: 145 parts by mass (14.5wt.%)

[0112] Graphite: 550 parts by mass (55wt.%)

[0113] Aluminum nitride powder: 300 parts by mass (30wt.%)

[0114] Platinum catalyst: 5 parts by mass (0.5wt.%)

[0115] (2) After the above-mentioned mixed material is vacuum removed, it is placed in an extrusion device, extruded into sheets through a split-combination...

Embodiment 2

[0124] In the present embodiment, each component that adopts is as follows:

[0125] Binder: two-component addition type liquid silicone;

[0126] Two-dimensional thermally conductive filler: graphene, with a sheet diameter of 5-30 μm and a layer number of 1-10;

[0127] Isotropic thermally conductive filler: alumina, average particle size 100μm, 50μm, 5μm, mass ratio 100μm:50μm:5μm=5:3:2;

[0128] Catalyst: Platinum Catalyst

[0129] The preparation and implementation process is as follows:

[0130] (1) The raw materials of each component are uniformly mixed according to the following mass parts ratio:

[0131] Two-component addition type liquid silica gel: 145 parts by mass (14.5wt.%)

[0132] Graphene: 450 parts by mass (45wt.%)

[0133] Alumina: 400 parts by mass (40wt.%)

[0134] Platinum catalyst: 5 parts by mass (0.5wt.%)

[0135] (2) After the above-mentioned mixed material is vacuum removed, it is placed in an extrusion device for extrusion. The material flows ...

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Abstract

The invention provides a heat-conducting gasket and a preparation method thereof. The method comprises the following steps: (1) mixing a binder, a two-dimensional heat-conducting filler and optional other components, and optionally performing vacuum defoamation to obtain a mixed material; (2) extruding the mixed material into a sheet through a split-combined die head; and (3) performing traction, calendering and vulcanization on the sheet to obtain the heat-conducting gasket.

Description

technical field [0001] The invention relates to a heat conduction gasket and a preparation method thereof, and more specifically relates to a longitudinal heat conduction gasket reinforced by a two-dimensional heat conduction filler, which belongs to the technical field of heat conduction and heat dissipation. Background technique [0002] The main methods of existing vertical high thermal conductivity gaskets include: magnetic field orientation method, electrostatic flocking method, and extrusion method. [0003] The principle of the magnetic field orientation method is to orient anisotropic thermally conductive fillers (such as carbon fibers) along the direction of the magnetic field through a super-strong magnetic field (such as >10T), thereby obtaining a longitudinally high thermal conductivity gasket. Since the thermally conductive filler has a high filling amount (such as >80wt.%) in the base glue, the viscosity of the material is very high (such as >10 6 mPa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C48/305B29C48/00B29C35/02C09K5/14B29L7/00
CPCB29C48/307B29C48/0011B29C35/02C09K5/14B29L2007/002
Inventor 葛翔李峰李壮张耀辉周步存
Owner CHANGZHOU FUXI TECH CO LTD
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