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Light source module of welding-free COB packaging structure

A light source module and packaging structure technology, which is applied in the direction of printed circuits, printed circuits, and electric solid devices connected to non-printed electrical components, can solve problems such as bonding wire misalignment, short-circuit connection, and packaging failure, which is not easy to achieve The effect of encapsulation failure, not easy to overflow, not easy to break

Active Publication Date: 2021-09-03
史巴克电子(苏州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the existing COB packaging technology has greatly reduced the technical requirements and cumbersomeness of packaging, it still requires considerable experience to complete the packaging work, and it is very easy to have problems such as bonding wire misalignment or short-circuit connection during the packaging process, which can easily lead to packaging failure. , Seriously, even in the process of piloting the official module, a fire accident was caused by a short circuit

Method used

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  • Light source module of welding-free COB packaging structure
  • Light source module of welding-free COB packaging structure
  • Light source module of welding-free COB packaging structure

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Embodiment 1

[0038] see Figure 1-5, a light source module with a solder-free COB packaging structure, comprising a metal substrate 1, an insulating layer 2 is fixedly connected to the upper end of the metal substrate 1, a circuit board 3 is fixedly connected to the upper end of the insulating layer 2, and a circuit board 3 is fixedly connected to an upper end of the circuit board 3. The glue dam 4 and a plurality of light source modules 5, the plurality of light source modules 5 are located inside the glue dam 4, the glue dam 4 is filled with encapsulation glue 6, the encapsulation glue 6 covers a plurality of light source modules 5, and the plurality of light source modules 5 is fixedly connected with a bonding wire 8, and the end of the bonding wire 8 away from the light source module 5 is covered with a storage spherical shell 11, and the end of the bonding wire 8 away from the light source module 5 runs through the storage spherical shell 11 and extends to the storage ball In the shel...

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Abstract

The invention discloses a light source module of a welding-free COB packaging structure, and belongs to the field of COB packaging structure. According to the light source module of the welding-free COB packaging structure, before assembly, straight rod parts and a spiral part outside a storage spherical shell can play a role in protection, so that the storage spherical shell is not prone to being broken, and fixing glue is not prone to overflowing; and on the other hand, because an adsorption contact is sealed in the storage spherical shell, the adsorption contact is not prone to be polluted by sundries in the transportation and storage process, normal electrification after assembly is not prone to influence, in the assembly process, the storage spherical shell is broken, the fixing glue is released, and the adsorption contact, the storage spherical shell and the spiral part are fixed on the surface of a circuit board by utilizing the fixing glue, a three-dimensional network structure formed by the spiral part in the storage spherical shell can quickly and uniformly transfer heat to all the straight rod parts outside the storage spherical shell, and then the heat is uniformly dissipated through the straight rod parts, so that the phenomenon that the heat cannot be timely dissipated due to excessive concentration of the heat is avoided.

Description

technical field [0001] The invention relates to the field of COB package structure, and more specifically, relates to a light source module with a solder-free COB package structure. Background technique [0002] The full name of COB packaging is chip-on-board packaging. It is a technology to solve the heat dissipation problem of LED. It is to adhere the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to realize its electrical connection. If the COB package The bare chip is directly exposed to the air, which is easily polluted or artificially damaged, affecting or destroying the function of the chip, so the chip and the bonding wire are encapsulated with glue. People also call this packaging form soft encapsulation. [0003] COB light source is a high-efficiency integrated surface light source technology that directly pastes LED chips on a mirror metal substrate with high reflectivity. This technology elimi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/54H01L33/62H05K1/18
CPCH01L25/0753H01L33/62H01L33/54H05K1/181H05K2201/10106
Inventor 薛理通
Owner 史巴克电子(苏州)有限公司
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