Light source module of welding-free COB packaging structure
A light source module and packaging structure technology, which is applied in the direction of printed circuits, printed circuits, and electric solid devices connected to non-printed electrical components, can solve problems such as bonding wire misalignment, short-circuit connection, and packaging failure, which is not easy to achieve The effect of encapsulation failure, not easy to overflow, not easy to break
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[0038] see Figure 1-5, a light source module with a solder-free COB packaging structure, comprising a metal substrate 1, an insulating layer 2 is fixedly connected to the upper end of the metal substrate 1, a circuit board 3 is fixedly connected to the upper end of the insulating layer 2, and a circuit board 3 is fixedly connected to an upper end of the circuit board 3. The glue dam 4 and a plurality of light source modules 5, the plurality of light source modules 5 are located inside the glue dam 4, the glue dam 4 is filled with encapsulation glue 6, the encapsulation glue 6 covers a plurality of light source modules 5, and the plurality of light source modules 5 is fixedly connected with a bonding wire 8, and the end of the bonding wire 8 away from the light source module 5 is covered with a storage spherical shell 11, and the end of the bonding wire 8 away from the light source module 5 runs through the storage spherical shell 11 and extends to the storage ball In the shel...
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