Light source module of welding-free COB packaging structure

A light source module and packaging structure technology, which is applied in the direction of printed circuits, printed circuits, and electric solid devices connected to non-printed electrical components, can solve problems such as bonding wire misalignment, short-circuit connection, and packaging failure, which is not easy to achieve The effect of encapsulation failure, not easy to overflow, not easy to break
CN113345873AActive Publication Date: 2021-09-03史巴克电子(苏州)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
史巴克电子(苏州)有限公司
Publication Date
2021-09-03

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Abstract

The invention discloses a light source module of a welding-free COB packaging structure, and belongs to the field of COB packaging structure. According to the light source module of the welding-free COB packaging structure, before assembly, straight rod parts and a spiral part outside a storage spherical shell can play a role in protection, so that the storage spherical shell is not prone to being broken, and fixing glue is not prone to overflowing; and on the other hand, because an adsorption contact is sealed in the storage spherical shell, the adsorption contact is not prone to be polluted by sundries in the transportation and storage process, normal electrification after assembly is not prone to influence, in the assembly process, the storage spherical shell is broken, the fixing glue is released, and the adsorption contact, the storage spherical shell and the spiral part are fixed on the surface of a circuit board by utilizing the fixing glue, a three-dimensional network structure formed by the spiral part in the storage spherical shell can quickly and uniformly transfer heat to all the straight rod parts outside the storage spherical shell, and then the heat is uniformly dissipated through the straight rod parts, so that the phenomenon that the heat cannot be timely dissipated due to excessive concentration of the heat is avoided.
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Description

technical field

[0001] The invention relates to the field of COB package structure, and more specifically, relates to a light source module with a solder-free COB package structure. Background technique

[0002] The full name of COB packaging is chip-on-board packaging. It is a technology to solve the heat dissipation problem of LED. It is to adhere the bare chip to the interconnection substrate with conductive or non-conductive adhesive, and then perform wire bonding to realize its electrical connection. If the COB package The bare chip is directly exposed to the air, which is easily polluted or artificially damaged, affecting or destroying the function of the chip, so the chip and the bonding wire are encapsulated with glue. People also call this packaging form soft encapsulation.

[0003] COB light source is a high-efficiency integrated surface light source technology that directly pastes LED chips on a mirror metal substrate with high reflectivity. This technology elimi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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