Diaphragm, MEMS microphone chip and manufacturing method thereof

A microphone and diaphragm technology, applied in the direction of semiconductor electrostatic transducers, electrostatic sensors, electrostatic transducer microphones, etc., can solve the problem of low-frequency response drop of MEMS microphones, and achieve low-frequency sensitivity, increase damping, and improve low-frequency response. Effect

Active Publication Date: 2021-09-03
山东新港电子科技有限公司
View PDF4 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under normal circumstances, the low-frequency response of the MEMS microphone drops due to the small air damping

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Diaphragm, MEMS microphone chip and manufacturing method thereof
  • Diaphragm, MEMS microphone chip and manufacturing method thereof
  • Diaphragm, MEMS microphone chip and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0075] Example 1: This embodiment provides a diaphragm, including a diaphragm body 30, such as image 3 As shown, a discharge valve 33 is provided on the diaphragm body 30, which includes a connection end connected to the diaphragm body 30 and a movable portion 332 of the connecting end, the outer peripheral edge and diaphragm of the movable portion 332. On the body 30, there is a stepped step edge, and the adjacent movable portion 332 or the stepped edge staggered setting between the movable portion 332 and the diaphragm body 30 forms a stepped platform, and a pore 331 is formed between the staggered step edge. The vertical section of the pore 331 is a stepped shape. That is, the pore 331 has a stepped section.

[0076] like image 3 As shown in the present embodiment, the step platform is one. That is, the "step number" of the cross section of the pore 331 is two.

[0077] Specifically, the shape of the diaphragm body 30 is circular, or other central symmetric pattern, the materia...

Example Embodiment

[0080] Example 2: An attached Figure 4 As shown in the present embodiment, the step platform is plural. That is, the "step number" of the cross section of the pore 331 is multiple. In this embodiment, the rest is the same as in Example 1.

[0081] In Example 1 of the present invention, if image 3 As shown, the "step number" of the cross section of the pore 331 is two; in Example 2 of the present invention, if Figure 4 As shown, the "step number" of the cross section of the pore 331 is three.

[0082] If you need to explain, see Figure 1 - Figure 2 The pore 331 of the existing air spasve 33 is typically set to a rectangle, although the discharge valve 33 can be opened when it is severely impacted, and the pressure is placed, but in normal case, the air splash valve 33 is in a non-open state. The rectangular pore 331 is too small to air, which can cause the MEMS microphone's low frequency response to a serious decline. In contrast, the stepped pore 331 provided by the embodiment of ...

Example Embodiment

[0083] Example 3: Such as Figure 5 As shown, the present invention also provides a MEMS microphone chip, including:

[0084] The substrate 10 is provided with a back cavity 11 along a downward direction;

[0085] The diaphragm body 30 is disposed on one side of the substrate 10, at least a portion of the diaphragm body 30 vibrates above the back cavity 11;

[0086] The backplane 60 is provided at one side where the diaphragm body 30 is left away from the substrate 10; the back plate 60 is also provided with one or more intervals arranged through holes 61, and the through hole 61 penetrates the back plate 60;

[0087] The vibration gap 53 is provided between the diaphragm body 30 and the back plate 60, and is located above the back chamber 11;

[0088] The diaphragm body 30, the back plate 60, and the vibration gap 53 together form a capacitor structure;

[0089] The sacrificial layer 52 is located between the diaphragm body 30 and the back plate 60 and is located outside the vibra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a diaphragm, an MEMS microphone chip and a manufacturing method thereof, at least two uniformly distributed air escape valves are arranged on a diaphragm body, and each air escape valve comprises a movable part and a hole; the holes are provided with step-shaped sections, and the number of steps of the step-shaped sections is one or more. According to the technical scheme disclosed by the invention, the air escape valve with the stepped pore section is arranged, so that the air escape valve can be opened to play a role in quickly releasing pressure when being violently impacted, and the damping of pores to air can be increased when the air escape valve is not opened, so that the low-frequency response of the MEMS microphone chip is improved; in addition, due to the adoption of the step-shaped structure, the sensitivity of low-frequency response to pore size deviation is reduced, so that the process precision requirement can be reduced, and the yield and the consistency of products are improved.

Description

technical field [0001] The invention belongs to the technical field of electroacoustic devices, in particular to a diaphragm, a MEMS microphone chip and a manufacturing method thereof. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) microphone has attracted people's attention due to its high sensitivity, low power consumption, flat frequency response and many other advantages, and has become the mainstream of today's microphone market. The MEMS chip is an important part of the MEMS microphone. Its working principle is: the diaphragm vibrates under the action of sound waves, which changes the distance between the diaphragm and the back plate, thereby changing the capacitance and converting the sound wave signal into an electrical signal. [0003] When the MEMS chip is subjected to severe impacts such as blowing or dropping, the diaphragm is easily broken and damaged due to excessive pressure, which leads to the failure of ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H04R19/00H04R19/04H04R31/00
CPCH04R19/005H04R19/04H04R31/00H04R2201/003
Inventor 不公告发明人
Owner 山东新港电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap