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Precise splicing process for planar slotted array antenna

A crack antenna, precision technology, applied in the field of precision assembly process of flat panel crack antenna, can solve the problem of poor assembly accuracy

Active Publication Date: 2021-09-10
常州市瑞昱通信设备制造有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to improve the problem of poor assembly accuracy between the radiating plate and the feeding cavity, this application provides a precision assembly process for flat-panel slot antennas

Method used

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  • Precise splicing process for planar slotted array antenna
  • Precise splicing process for planar slotted array antenna
  • Precise splicing process for planar slotted array antenna

Examples

Experimental program
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Embodiment Construction

[0047] The following is attached Figure 1-7 The application is described in further detail.

[0048] The embodiment of the present application discloses a precision assembly process of a flat plate slot antenna. refer to figure 1 , the precise assembly process of the flat-panel slot antenna, including the following steps:

[0049] S1, pretreatment, conducting conductive oxidation on the pre-machined feeding chamber 20 and the radiation plate 10, and moving the feeding chamber 20 and the radiation board 10 to the workbench 1;

[0050] S2, pre-positioning, placing the radiant panel 10 on the horizontal adjusting device 2, and limiting the radiating panel 10, connecting the feeding cavity 20 and the longitudinal adjusting device 4 through the vacuum chuck 423, and limiting the feeding cavity 20 bit;

[0051] S3, longitudinal adjustment: slowly adjust the position of the feed chamber 20 through the longitudinal adjustment device 4, and monitor the longitudinal relative positi...

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Abstract

The invention relates to the field of panel antennas, in particular to a precise splicing process for a planar slotted array antenna. The process comprises the steps of pretreating, namely conducting conductive oxidation on a feed cavity and a radiant panel which are machined in advance; pre-positioning, namely limiting the radiant panel on a transverse adjustment device, connecting the feed cavity with a longitudinal adjustment device through a vacuum chuck, and limiting the feed cavity; conducting longitudinal adjustment, namely slowly adjusting the position of the feed cavity through the longitudinal adjustment device; conducting transverse adjustment, namely slowly adjusting the position of the radiant panel through the transverse adjustment device; conducting preliminary connection, namely driving the feed cavity to be close to the feed cavity through a lifting device until the radiant panel and the feed cavity are mutually attached, and conducting brazing or bonding on partial edges of the feed cavity and the radiant panel; and completing splicing, namely conducting brazing or bonding on the rest edges of the feed cavity and the radiant panel. According to the process, the radiant panel and the feed cavity can be accurately aligned, the assembly precision between the feed cavity and the radiant panel can be improved, and the product quality can be improved.

Description

technical field [0001] The present application relates to the field of planar antennas, in particular to a precision assembly process for planar slot antennas. Background technique [0002] The plate slot antenna has the advantages of high gain, low side lobe level, small size and light weight, and is widely used in airborne radar, communication and other fields. The area array of the planar slot antenna is mainly composed of two parts, the radiation plate and the feed cavity, and the splicing methods between the radiation plate and the feed cavity include welding, riveting, and bonding, among which welding and riveting are mainly used. [0003] The existing patent application number is the Chinese patent of CN201110268548.0, which proposes a bonding processing method for a flat plate slot array antenna, including the following steps: 1) complete set: the pre-machined feed waveguide, the feed plate , The radiation board is ready; 2) Surface treatment: conduct conductive oxi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00F16B11/00
CPCB23K1/00B23K1/0008F16B11/00F16B11/006
Inventor 宋铮张建兴宋娜王建华张寅
Owner 常州市瑞昱通信设备制造有限公司