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Rigid-flex circuit board and preparation method thereof

A technology of combination of soft and hard, circuit board, applied in the direction of multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc. and other problems to achieve the effect of improving quality hidden dangers, reducing preparation costs and improving quality

Active Publication Date: 2021-09-17
CAMELOT QINGYUAN HYTEC TECH INVESTMENT
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  • Abstract
  • Description
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Problems solved by technology

[0002] The development trend of miniaturization, multi-function and high reliability of electronic products requires the packaging form of electronic products to develop towards three-dimensional assembly. Rigid circuit boards can provide rigid circuit boards by combining the advantages of rigid circuit boards and flexible circuit boards. The support of the board can also realize the resistance to bending, and is widely used in the three-dimensional assembly of electronic products. However, when the traditional soft-hard board is arranged, the prepreg is used to mill the window, and the three-in-one buffer material is used for pressing. Glue overflow is difficult to control during the process, resulting in a decline in the quality of the prepared rigid-flex circuit boards, which in turn makes the rigid-flex circuit boards fail to meet user requirements

Method used

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  • Rigid-flex circuit board and preparation method thereof

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Embodiment Construction

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0037] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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Abstract

The invention provides a rigid-flex circuit board and a preparation method thereof. The rigid-flex circuit board comprises a flexible circuit board, a first rigid circuit board, a second rigid circuit board and a pattern pressing belt. The pattern pressing belt comprises a first PI film and a second PI film, two opposite side surfaces of the first PI film form a fusion layer and are respectively bonded with the flexible circuit board and the first rigid circuit board, and two opposite side surfaces of the second PI film form a fusion layer and are respectively bonded with the flexible circuit board and the second rigid circuit board. The rigid-flex circuit board is good in quality and can better meet the requirements of customers.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a rigid-flex circuit board and a preparation method thereof. Background technique [0002] The development trend of miniaturization, multi-function and high reliability of electronic products requires the packaging form of electronic products to develop towards three-dimensional assembly. Rigid circuit boards can provide rigid circuit boards by combining the advantages of rigid circuit boards and flexible circuit boards. The support of the board can also realize the resistance to bending, and is widely used in the three-dimensional assembly of electronic products. However, when the traditional soft-hard board is arranged, the prepreg is used to mill the window, and the three-in-one buffer material is used for pressing. Glue overflow in the process is difficult to control, resulting in a decline in the quality of the prepared rigid-flex circuit board, which in tur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/46
CPCH05K1/144H05K3/4691
Inventor 赵玉梅周咏陈贵华付少伟
Owner CAMELOT QINGYUAN HYTEC TECH INVESTMENT
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