Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lead-free solder paste capable of resisting head-in-pillow effect and preparation method of lead-free solder paste

A lead-free solder paste and effect technology, used in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of pillow effect and weak solder paste activity.

Active Publication Date: 2021-09-28
中山翰华锡业有限公司
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention is an anti-pillow effect lead-free solder paste to solve the problem that the activity of the solder paste in the prior art is weak and easy to cause the pillow effect. The solder paste of the present invention By optimizing the composition of tin powder and flux, it has high activity and good wettability, so that the solder paste still maintains good soldering activity under continuous high-temperature baking, and inhibits the oxidation film on the solder surface during reflow soldering heating. Generation, to ensure good contact between solder and solder paste, to prevent the generation of pillow effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead-free solder paste capable of resisting head-in-pillow effect and preparation method of lead-free solder paste
  • Lead-free solder paste capable of resisting head-in-pillow effect and preparation method of lead-free solder paste
  • Lead-free solder paste capable of resisting head-in-pillow effect and preparation method of lead-free solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032]A lead-free solder paste of anti-pillow effect, comprising the following weight components, 85.12% tin flour, 11.92%, dispersant 2.96%, wherein the tin powder is dispensed, such as Table 2, the help The distribution of the flux is as described in Table 3, the dispersing agent is an oleic acid amide; the preparation method thereof, including the following steps:

[0033] According to Table 2, the weight percentage of Table 3 refers to each component, backup; first add the solvent to the container, heated to 110 ° C, then add rosin, stir until the rosin is completely dissolved, maintain the temperature at 110 ° C, will touch The variable agent is added to the container, maintains the temperature and stir until completely dissolve; the temperature drops to 60 ° C, the active agent, the antioxidant, the temperature is maintained and stirred for 30 minutes; the mixture is ground to grasses at 4000 r / min. The diameter is less than 20 microns to obtain a flux; 11.92% of the fluxi...

Embodiment 2

[0035] A lead-free solder paste, including the following weight components, 84.8% tin flour, 13.8%, dispersant 1.4%, wherein the tin powder is dispensed, such as Table 2, the help The distribution of the flux is described, for example, the dispersant is a mixture of ethyl bisteanamide and polyacryl dimethylsulfonate 1: 1 mixed; the preparation method, including the following steps:

[0036] According to Table 2, the weight percentage of Table 3 refers to the components, spare; add the solvent to the container, heated to 130 ° C, then add rosin, stir into the rosin completely dissolved, keep the temperature at 130 ° C, will thicken The agent is added to the container, maintains the temperature and stir it until it completely dissolves; the temperature drops to 50 ° C, the active agent, the antioxidant, the temperature is maintained and stirred for 25 minutes; the mixture was ground to the particle diameter of 5000 r / min. 20 microns to obtain flux; 13.8% flux and 84.8% tin powder ...

Embodiment 3

[0038] A lead-free solder paste, including the following weight components, 86.11% tin flour, 10.09%, dispersant, and a dispersant, wherein the tin powder is shown, the help The distribution of the flux is, for example, Table 3, the dispersing agent is a dual alicyamide; the preparation method, including the following steps:

[0039] According to Table 2, the weight percentage of Table 3 refers to each component, backup; add the solvent to the container, heated to 120 ° C, then add rosin, stir well completely dissolved, keep the temperature at 120 ° C, will throw The agent is added to the container, the temperature is maintained and stirred until completely dissolve; the temperature drops to 80 ° C, the active agent, the antioxidant, the temperature is maintained and stirred for 20 minutes; the mixture is grounded at 3000 r / min to ground the particle diameter at a rotational speed of 3000 r / min. 20 microns to obtain flux; 10.09% flux and 86.11% tin powder and 3.8% dispersant w...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
softening pointaaaaaaaaaa
acid valueaaaaaaaaaa
Login to View More

Abstract

The invention discloses a lead-free solder paste capable of resisting the head-in-pillow effect and a preparation method of the lead-free solder paste. According to the technical scheme, the lead-free solder paste is prepared from the following components of, in percentage by weight, 84.8%-90.6% of tin powder, 8.2%-13.8% of scaling powder and 1.2%-3.8% of dispersing agent, the tin powder is composed of 2.8%-4.5% of Ag, 1.5%-2.1% of Cu, 0.5%-1.2% of Bi, 0.1%-0.5% of Sb and the balance Sn, and the scaling powder is composed of 36.4%-47.3% of rosin, 19.9%-30.6% of solvent, 6.2%-15.1% of thixotropic agent, 14.3%-22.5% of active agent and 1.2%-5.6% of antioxidant. The components of the tin powder and the soldering flux are optimized, and the active agent is a compound combination of organic acid and organic amine in a ratio of 1: 1 or 1: 2, so that the solder paste has relatively high activity and good wettability, the solder paste still keeps good welding activity under continuous high-temperature baking, generation of an oxidation film on the surface of a solder during reflow soldering heating is inhibited, good contact between the solder and the solder paste is ensured, and the head-in-pillow effect is prevented.

Description

[0001] This application is a divisional application of Application No. 2019102105693 original application, filed 20 March 2019, entitled patented invention: one kind of lead-free solder paste and its preparation method. Technical field [0002] The present invention belongs to the technical field of welding materials, and particularly relates to a method for preparing lead-free solder paste anti pillow effect. Background technique [0003] Solder paste is a homogeneous stable flux and solder powder by a certain percentage of the uniformly mixed into paste, the welding wire can be the upper end of the PCB or PCB surface mount pads to form an alloy components connection. But when the assembly BGA on the PCB or PCB CAP, pillow effect (Head-in-Pillow, HIP) generated by the electronic manufacturing industry make very distressed. [0004] Pillows effect soldering the BGA component is used to describe a circuit board in the high temperature reflow process (Reflow) in, BGA solder balls, a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/02B23K35/26B23K35/36B23K35/40
CPCB23K35/025B23K35/262B23K35/3612B23K35/40
Inventor 李爱良杨玉红童桂辉付波汪亮冷学魁
Owner 中山翰华锡业有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com