Circuit board inner layer punching machine die automatic position adjusting structure and position adjusting method

Abstract

The invention discloses a circuit board inner layer punching machine die automatic position adjusting structure and a position adjusting method. The position adjusting structure comprises a die, a movement driving mechanism and a positioning plate, wherein the die carries an industrial camera and at least one punching needle; the die is further provided with a positioning assembly; the movement driving mechanism is connected with the die and is used for driving the die to move so as to drive the punching needle to move; a plurality of positioning holes are formed in the positioning plate along the moving path of the die; and the positioning assembly comprises a positioning pin and an entry / exit driving mechanism for driving the positioning pin to go in or out of the positioning holes. According to the die automatic position adjusting structure, the punching needles are moved to the designated position through the movement driving mechanism, the die bearing the punching needles is further fixed to the designated position through cooperation of the positioning assembly and the positioning plate, and the situation that the punching precision is affected by dislocation caused by deviation when the punching needles move downwards is avoided; and the movement and positioning of the die are full-automatic processes without manual intervention, so that the labor intensity is greatly reduced, the working efficiency is improved, and the repeatability is good.

Description

technical field [0001] The invention relates to an automatic position adjustment structure and a position adjustment method for a mold of a circuit board inner layer punching machine. Background technique [0002] In the process of circuit board production, punching is a necessary process, and there are many automatic punching machines in the prior art, but the control accuracy is not satisfactory, and the punching needle is unstable during the punching process. And the problem of inaccurate alignment accuracy, and the replacement process of the punching needle is complicated and cumbersome, which not only wastes a lot of manpower, material resources and economic costs, but also easily causes scrapping of the circuit board. Moreover, in the prior art, manual visual positioning is mainly used before punching. The disadvantage of this positioning operation method is that it is labor-intensive, low in efficiency, and cannot meet the needs of unmanned operations. Contents of t...

AI Technical Summary

Problems solved by technology

[0002] In the process of circuit board production, punching is a necessary process, and there are many automatic punching machines in the prior art, but the control accuracy is not satisfactory, and the punching needle is unstable during the punching process. And the problem of inaccurate alignment accuracy, and the replacement process of the punching needle is complicated and cumbersome, which not only wastes a lot of manpower, material resources and economic costs, but also easily leads to the scrapping of the circuit board

Moreover, in the prior art, manual visual positioning is mainly used before punching. The disadvantage of this positioning operation method is that it is labor-intensive, low in efficiency, and cannot meet the needs of unmanned operations.

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